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CFexpress - -401 0457 00 Rev. A
© 1 2019 | Delkin Devices Inc.
CFexpress
Engineering Specification
Document Number: 401-0457- 00
Revision: A
CFexpress - -401 0457 00 Rev. A
© 2 2019 | Delkin Devices Inc.
Product Overview
Capacities
128, 256, 512 GB
Form Factor
CFexpress Type B
PCIe Interface
NVMe PCIe Gen 3 x 2
Compliance
NVMe 1.3
PCI Express Base 3.1
Performance1
Read: up to 1600 MB/s
Write: up to 1000MB/s
Reliability
Mean Time Between Failure (MTBF)
More than TBD hours
Uncorrectable Bit Error Rate (UBER) < 1
sector per 1016 bits read
Advanced Flash Management
Static and Dynamic Wear Leveling
Bad Block Management
TRIM
SMART
Over-Provisioning
Firmware Update Capability
Power Management
Support APST
Support ASPM
Support L1.2
Power Consumption2
Idle < 50 mW
L1.2 < 2 mW
Temperature Range
Operation: - 40°C to 85°C
Storage: - 40°C to 85°C
RoHS-Compliant
Features Support List:
End to end data path protection
Thermal throttling
SmartECCTM
SmartRefreshTM
Drive log
Support of TCG OPAL3
Support of TCG Pyrite4
N : OTES
1. Refer to Chapter 2 Section 1.1 for more details
2. Refer to Chapter 4, Section 4.2 Power Consumption for more details.
3. Supported by a separate firmware version. Further information available upon request.
4. Supported by a separate firmware version. Further information available upon request.
CFexpress - -401 0457 00 Rev. A
© 3 2019 | Delkin Devices Inc.
TABLE OF CONTENTS
1. INTRODUCTION ............................................................................................................... 5
1.1. General Description ........................................................................................................... 5
1.2. Product Block Diagram 5......................................................................................................
1.3. Flash Management ............................................................................................................ 5
1.3.1. Error Correction Code (ECC) .................................................................................... 5
1.3.2. Wear Leveling 5.........................................................................................................
1.3.3. Bad Block Management .......................................................................................... 6
1.3.4. TRIM ........................................................................................................................ 6
1.3.5. SMART ..................................................................................................................... 6
1.3.6. Over-Provisioning .................................................................................................... 7
1.3.7. Firmware Upgrade .................................................................................................. 7
1.3.8. Thermal Throttling .................................................................................................. 7
1.4. GuaranteedFlushTM ............................................................................................................ 7
1.5. Advanced Device Security Features ................................................................................... 7
1.5.1. Secure Erase ............................................................................................................ 7
1.5.2. Crypto Erase ............................................................................................................ 8
1.5.3. Physical Presence SID (PSID) ................................................................................... 8
1.6. SSD Lifetime Management 8................................................................................................
1.6.1. Terabytes Written (TBW) ......................................................................................... 8
1.6.2. Media Wear Indicator ............................................................................................. 8
1.6.3. Read Only Mode (End of Life) 9.................................................................................
1.7. Adaptive Approach to Performance Tuning 9......................................................................
1.7.1. Throughput ............................................................................................................. 9
1.7.2. Predict & Fetch ........................................................................................................ 9
1.7.3. SLC Caching ............................................................................................................. 9
2. PRODUCT SPECIFICATIONS ............................................................................................ 10
3. ENVIRONMENTAL SPECIFICATIONS ................................................................................ 12
3.1. Environmental Conditions ...............................................................................................12
3.1.1. Temperature and Humidity ................................................................................... 12
3.1.2. Shock ..................................................................................................................... 13
3.1.3. Vibration ............................................................................................................... 13
3.1.4. Drop ......................................................................................................................13

Produktspecifikationer

Varumärke: Delkin Devices
Kategori: Flashminne
Modell: CFexpress

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