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Sida 1/145
Version 1.0
Published August 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
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H170 Combo
Motherboard Layout
Intel
H170
DDR3_B1 ( 64 bit, 240- p in module )
DDR4_A1 (6 4 bi t , 2 88-pin m o dule)
DDR4_B1 ( 64 bit, 288- p in module )
DDR3_B2 ( 64 bit, 240- p in module )
ATX 112V
USB 3.0
T: USB1
B: USB2
ATX PWR1
PCIE2
Top:
RJ -4 5
US 3.B 0
T: USB7
B: USB8
PCIE4
USB_11_12
1
USB _9_ 10
11
SPK_ PLE D1
COM 1
1
1
HD_AUDIO1
H170 oComb
PCIE1
RoHS
5
6
7
18
19 1 7
2324
1
25
26
2 3
22
PS2
Key boa rd
/Mou se
M2 _1
CT 22CT 23CT 24CT 25
21
4
1
16
CP U_F AN2CPU_ FAN1
CH A_FAN 3
CH A_FAN 2
CH A_FAN 1
20
1
TP MS1
CT 21
LAN
US 3.B 0
T: 3USB
B: USB 4
DDR3_A2 (6 4 bi t , 2 40-pin m o dule)
DDR3_A1 (6 4 bi t , 2 40-pin m o dule)
12
SATA_E _ 2
SATA_E _ 1 SATA3_ 0SATA3_ 4
SAT A3_ 2SAT A3_ 5
SATA3_ 1
SAT A3_ 3
8
15
9
14
10
13
11
CMOS
Battery
Super
I/O
PC ExpressI 03.
HD LED RES ET
PLED P WRBT N
PAN EL1
1
A oud i
CO D EC
CLR CMO S1
1
128Mb
BIOS
Front B 0US 3.
PCIE3
PCI2
PCI1
DVI1
HDM I1
Top:
SIDE SP K
Ce nte r:
REAR SPK
Bo tt o m:
CT R BASS
Top:
LINE IN
Ce nte r:
FRONT
Bo tt o m:
MIC IN
USB _5_6
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No. Description
1 ATX 12V Power Connector (ATX12V1)
2 4 x 240-pin DDR3/DDR3L DIMM Slots
(DDR3_A1, DDR3_A2, DDR3_B1, DDR3_B2)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 Chassis Fan Connector (CHA_FAN3)
5 ATX Power Connector (ATXPWR1)
6 USB 3.0 Header (USB_5_6)
7 Chassis Fan Connector (CHA_FAN2)
8 SATA3 Connector (SATA3_0)
9 SATA3 Connector (SATA3_2)
10 SATA3 Connector (SATA3_1)
11 SATA3 Connector (SATA3_3)
12 SATA Express Connector (SATA_E_1)
13 SATA Express Connector (SATA_E_2)
14 SATA3 Connector (SATA3_5)
15 SATA3 Connector (SATA3_4)
16 System Panel Header (PANEL1)
17 Power LED and Speaker Header (SPK_PLED1)
18 USB 2.0 Header (USB_11_12)
19 USB 2.0 Header (USB_9_10)
20 Clear CMOS Jumper (CLRMOS1)
21 Chassis Fan Connector (CHA_FAN1)
22 TPM Header (TPMS1)
23 COM Port Header (COM1)
24 Front Panel Audio Header (HD_AUDIO1)
25 CPU Fan Connector (CPU_FAN1)
26 CPU Fan Connector (CPU_FAN2)
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H170 Combo
I/O Panel
No. No.Description Description
1 PS/2 Mouse/Keyboard Port 8 Central / Bass (Orange)
2 LAN RJ-45 Port* 9 USB 3.0 Ports (USB_78)
3 Side Speaker (Gray) USB 3.0 Ports (USB_34) 10
4 Rear Speaker (Black) 11 HDMI Port
5 Line In (Light Blue) 12 DVI-D Port
6 Front Speaker (Lime)** USB 3.0 Ports (USB_12) 13
7 Microphone (Pink)
10
1
13 11 912
2 4
3
6
5
78
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* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
Activity / Link LED Speed LED
Status StatusDescription Description
Of No Link Of 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
** If you use a 2-channel speaker, please connect the speaker’s plug into “Front Speaker Jack”. See the table below
for connection details in accordance with the type of speaker you use.
Audio Output
Channels
Front Speaker
(No. 6)
Rear Speaker
(No. 4)
Central / Bass
(No. 8)
Side Speaker
(No. 3)
2V -- -- --
4V V -- --
6V V V --
8V V V V
To enable Multi-Streaming, you need to connect a front panel audio cable to the front
panel audio header. Aer restarting your computer, you will nd the “Mixer” tool on
your system. Please select “Mixer ToolBox” , click “Enable playback multi-stream-
ing”, and click “ok”. Choose “2CH”, “4CH”, “6CH”, or “8CH” and then you are allowed
to select “Realtek HDA Primary output” to use the Rear Speaker, Central/Bass, and
Front Speaker, or select “Realtek HDA Audio 2nd output” to use the front panel audio.
ACT/LINK LED
SPEED LED
LAN Port
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H170 Combo
Chapter 1 Introduction
ank you for purchasing ASRock H170 Combo motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
1.1 Package Contents
ASRock H170 Combo Motherboard (ATX Form Factor)
ASRock H170 Combo Quick Installation Guide
ASRock H170 Combo Support CD
2 x Serial ATA (SATA) Data Cables (Optional)
1 x I/O Panel Shield
1 x Screw for M.2 Socket
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modi-
cations of this documentation occur, the updated version will be available on ASRock’s
website without further notice. If you require technical support related to this mother-
board, please visit our website for specic information about the model you are using. You
may nd the latest VGA cards and CPU support list on ASRock’s website as well. ASRock
website http://www.asrock.com.
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1.2 Specications
Platform ATX Form Factor
Solid Capacitor design
CPU Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
Digi Power design
10 Power Phase design
Supports Intel® Turbo Boost 2.0 Technology
Chipset Intel® H170
Supports Intel® Small Business Advantage 4.0
Memory Dual Channel DDR4/DDR3/DDR3L Memory Technology
2 x DDR4 DIMM Slots
Supports DDR4 2133 non-ECC, un-buered memory
Max. capacity of system memory: 32GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
15 Gold Contact in DDR4 DIMM Slots
4 x DDR3/DDR3L DIMM Slots
Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-buered memory
* Supports 2 x DDR3/DDR3L memory modules up to 1866(OC)
and 4 x DDR3/DDR3L memory modules up to 1333
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
Max. capacity of system memory: 64GB
Expansion
Slot
2 x PCI Express 3.0 x16 Slots (PCIE2: x16 mode; PCIE4: p8-x4
mode)*
* Supports NVMe SSD as boot disks
2 x PCI Express 3.0 p8-x1 Slots (Flexible PCIe)
2 x PCI Slots
* PCI cards that need subtractive decode are not supported.
Supports AMD Quad CrossFireXTM and CrossFireXTM
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H170 Combo
Graphics Intel® HD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with HEVC, AVC, MVC (S3D) and MPEG-2
Full HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® Insider
TM, Intel® HD Graphics 510/530
Pixel Shader 5.0, DirectX 12
Max. shared memory 1792MB
Dual graphics output: Support DVI-D and HDMI ports by
independent display controllers
Supports HDMI with max. resolution up to 4K x 2K
(4096x2160) @ 24Hz / (3840x2160) @ 30Hz
Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
HBR (High Bit Rate Audio) with HDMI Port (Compliant
HDMI monitor is required)
Supports Accelerated Media Codecs: HEVC, VP8, VP9
Supports HDCP with DVI-D and HDMI Ports
Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
and HDMI Ports
Audio 7.1 CH HD Audio with Content Protection (Realtek ALC892
Audio Codec)
Premium Blu-ray Audio support
Supports Surge Protection (ASRock Full Spike Protection)
ELNA Audio Caps
LAN Gigabit LAN 10/100/1000 Mb/s
Giga PHY Intel® I219V
Supports Wake-On-LAN
Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
Supports Energy Ecient Ethernet 802.3az
Supports PXE
Rear Panel
I/O
1 x PS/2 Mouse/Keyboard Port
1 x DVI-D Port
1 x HDMI Port
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6 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
HD Audio Jacks: Side Speaker / Rear Speaker / Central / Bass
/ Line in / Front Speaker / Microphone
Storage 6 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,
RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology
14 and Intel Smart Response Technology), NCQ, AHCI and
Hot Plug
2 x SATA Express 10 Gb/s Connectors*
* Support to be announced
* If M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will
be disabled.
1 x Ultra M.2 Socket, supports M.2 SATA3 6.0 Gb/s module
and M.2 PCI Express module up to Gen3 p10-x4 (32 Gb/s)
* Supports ASRock U.2 Kit
Connector 1 x COM Port Header
1 x TPM Header
1 x Power LED and Speaker Header
2 x CPU Fan Connectors (4-pin) (Smart Fan Speed Control)
3 x Chassis Fan Connectors (4-pin) (Smart Fan Speed Con-
trol)
1 x 24 pin ATX Power Connector
1 x 8 pin 12V Power Connector
1 x Front Panel Audio Connector
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
BIOS
Feature
128Mb AMI UEFI Legal BIOS with multilingual GUI sup-
port
ACPI 1.1 Compliant wake up events
SMBIOS 2.3.1 Support
CPU, GT_CPU, DRAM, VPPM, PCH 1.0V, VCCIO, VC-
CPLL, VCCSA Voltage Multi-adjustment
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H170 Combo
Hardware
Monitor
CPU/Chassis temperature sensing
CPU/Chassis Fan Tachometer
CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
CPU/Chassis Fan multi-speed control
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
VPPM, PCH 1.0V, VCCIO, VCCSA
OS Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 140 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock’s
website for details: http://www.asrock.com
Certica-
tions
FCC, CE, WHQL
ErP/EuP Ready (ErP/EuP ready power supply is required)
Please realize that there is a certain risk involved with overclocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technology, or using third-party
overclocking tools. Overclocking may aect your system’s stability, or even cause damage to
the components and devices of your system. It should be done at your own risk and expense.
We are not responsible for possible damage caused by overclocking.
* For detailed product information, please visit our website:
http://www.asrock.com
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H170 Combo
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the is on the PnP cap
socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not
force to insert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power cables before installing the CPU.
1
2
A
B
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4
5
3
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2.2 Installing the CPU Fan and Heatsink
1 2
CPU_ FAN
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H170 Combo
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) and four 240-
pin DDR3/DDR3L (Double Data Rate 3) DIMM slots, and supports Dual Channel
Memory Technology.
Dual Channel Memory Conguration
e DIMM only ts in one correct orientation. It will cause permanent damage to the
motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.
Priority DDR3_A1 DDR3_A2 DDR4_A1 DDR3_B1 DDR3_B2 DDR4_B1
1Populated Populated
2Populated Populated
3Populated Populated Populated Populated
1. For dual channel conguration, you always need to install identical (the same brand,
speed, size and chip-type) DDR4 or DDR3/DDR3L DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one or three memory
module installed.
3. It is not allowed to install a DDR or DDR2 memory module into a DDR3 slot, or a DDR,
DDR2 or DDR3 memory module into a DDR4 slot; otherwise, this motherboard and
DIMM may be damaged.
Warning! It is NOT allowed to install a memory module into a DDR4 slot and a DDR3 slot
simultaneously; otherwise, this motherboard and DIMM may be damaged.
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1
2
3
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H170 Combo
2.4 Expansion Slots (PCI and PCI Express Slots)
ere are 2 PCI slots and 4 PCI Express slots on the motherboard.
PCI slot:
e PCI1 and PCI2 slots are used to install expansion cards that have 32-bit PCI
interface.
PCIe slots:
PCIE1 (PCIe 3.0 p19-x1 slot) is used for PCI Express p19-x1 lane width cards.
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE3 (PCIe 3.0 p19-x1 slot) is used for PCI Express p19-x1 lane width cards.
PCIE4 (PCIe 3.0 x16 slot) is used for PCI Express p19-x4 lane width graphics cards.
PCIe Slot Congurations
Before installing an expansion card, please make sure that the power supply is switched o
or the power cord is unplugged. Please read the documentation of the expansion card and
make necessary hardware settings for the card before you start the installation.
For a better thermal environment, please connect a chassis fan to the motherboard’s
chassis fan connector (CHA_FAN1, CHA_FAN2 or CHA_FAN3 when using multiple
graphics cards.
PCIE2 PCIE4
Single Graphics Card x16 N/A
Two Graphics Cards in
CrossFireX TM x16 x4
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper
is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short”
when a jumper cap is placed on these 2 pins.
Clear CMOS Jumper
(CLRMOS1)
(see p.1, No. 20)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed.
Clear CMOSDefault
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H170 Combo
2.6 Onboard Headers and Connectors
System Panel Header
(9-pin PANEL1)
(see p.1, No.16)
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
GND
R #ESET
PWRBTN#
PLED-
PLED+
GND
HDLED-
HDLED+
1
GND
PWRBTN (Power Switch):
Connect to the power switch on the chassis front panel. You may congure the way to turn
o your system using the power switch.
RESET (Reset Switch):
Connect to the reset switch on the chassis front panel. Press the reset switch to restart the
computer if the computer freezes and fails to perform a normal restart.
PLED (System Power LED):
Connect to the power status indicator on the chassis front panel. e LED is on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Hard Drive Activity LED):
Connect to the hard drive activity LED on the chassis front panel. e LED is on when the
hard drive is reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists of power
switch, reset switch, power LED, hard drive activity LED, speaker and etc. When connect-
ing your chassis front panel module to this header, make sure the wire assignments and the
pin assignments are matched correctly.
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
headers and connectors. Placing jumper caps over the headers and connectors will cause
permanent damage to the motherboard.
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H170 Combo
USB 3.0 Headers
(19-pin USB_5_6)
(see p.1, No. 6)
Besides six USB 3.0 ports
on the I/O panel, there
is one header on this
motherboard. is USB
3.0 header can support
two ports.
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.1, No. 24)
is header is for
connecting audio devices
to the front audio panel.
Chassis Fan Connectors
(4-pin CHA_FAN1)
(see p.1, No. 21)
(4-pin CHA_FAN2)
(see p.1, No. 7)
(4-pin CHA_FAN3)
(see p.1, No. 4)
Please connect fan cables
to the fan connectors and
match the black wire to
the ground pin.
1
IntA_PB_D+
Dummy
IntA_PB_D-
GND
IntA_PB_SSTX+
GND
IntA_PB_SSTX-
IntA_PB_SSRX+
IntA_PB_SSRX-
VbusVbus
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GND
OUT2_R
MIC2_R
MIC2_L
OUT_RET
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis must sup-
port HDA to function correctly. Please follow the instructions in our manual and chassis
manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio header by the
steps below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_RET and OUT_RET are for the HD audio panel only. You don’t need to connect
them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and
adjust “Recording Volume”.
GN
D
FAN_VOLTAGE
CHA_FAN_SPEED
F
AN_SPEED_CONTROL
GN
D
FAN_VOLTAGE
CHA_FAN_SPEED
F
AN_SPEED_CONTROL
GND
CHA_FAN_SPEED
FAN_SPEED_CONTR
OL
FAN_VOLTAGE
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CPU Fan Connectors
(4-pin CPU_FAN1)
(see p.1, No. 25)
(4-pin CPU_FAN2)
(see p.1, No. 26)
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
ATX Power Connector
(24-pin ATXPWR1)
(see p.1, No. 5)
is motherboard
provides a 24-pin ATX
power connector. To use a
20-pin ATX power supply,
please plug it along Pin 1
and Pin 13.
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.1, No. 1)
is motherboard pro-
vides an 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
Serial Port Header
(9-pin COM1)
(see p.1, No. 23)
is COM1 header
supports a serial port
module.
TPM Header
(17-pin TPMS1)
(see p.1, No. 22)
is connector supports Trusted
Platform Module (TPM) system,
which can securely store keys,
digital certicates, passwords,
and data. A TPM system also
helps enhance network security,
protects digital identities, and
ensures platform integrity.
FAN_VOLTAGE
GND
FAN_SPEED
FAN_SPEED_CONTROL
1
2
3
4
CCTS#1
RRTS#1
DDSR#1
DDTR#1
RRXD1
GND
TTXD1
DDCD#1
1
RRI#1
1
GN D
SMB_DATA_MAIN
LAD2
LAD1
GN D
S_PWRDWN #
SERIRQ #
GND
PCICLK
PCIRST
#
LAD3
+3 V
LAD0
+3VS B
GN D
FRAM E
SMB_CLK_MAI N
12
1
24
13
1 4
5 8
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H170 Combo
2.7 M.2_SSD (NGFF) Module Installation Guide
The M.2, also known as the Next Generation Form Factor (NGFF), is a small size and
versatile card edge connector that aims to replace mPCIe and mSATA. The Ultra M.2
Sockets support M.2 PCI Express module up to Gen3 p25-x4 (32 Gb/s).
* If M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will be disabled.
Installing the M.2_SSD (NGFF) Module
Step 1
Prepare a M.2_SSD (NGFF) module
and the screw.
3
2
4
5
BCDE A
1
Step 2
Depending on the PCB type and
length of your M.2_SSD (NGFF)
module, nd the corresponding nut
location to be used.
No. 1 2 3 4 5
Nut Location A B C D E
PCB Length 3cm 4.2cm 6cm 8cm 11cm
Module Type Type2230 Type 2242 Type2260 Type 2280 Type 22110
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BCDE A
Step 3
Move the stando based on the
module type and length.
e stando is placed at the nut
location D by default. Skip Step 3
and 4 and go straight to Step 5 if you
are going to use the default nut.
Otherwise, release the stando by
hand.
BCDE A
Step 4
Peel o the yellow protective lm on
the nut to be used. Hand tighten the
stando into the desired nut location
on the motherboard.
BC A
ABCDE
Step 5
Align and gently insert the M.2
(NGFF) SSD module into the M.2
slot. Please be aware that the M.2
(NGFF) SSD module only ts in one
orientation.
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H170 Combo
Deutsch
1 Einleitung
Vielen Dank, dass Sie sich für das H170 Combo von ASRock entschieden haben – ein
zuverlässiges Motherboard, das konsequent unter der strengen Qualitätskontrolle von
ASRock hergestellt wurde. Es liefert ausgezeichnete Leistung mit robustem Design,
das ASRock Streben nach Qualität und Beständigkeit erfüllt.
1.1 Lieferumfang
Da die technischen Daten des Motherboards sowie die BIOS-Soware aktualisiert werden
können, kann der Inhalt dieser Dokumentation ohne Ankündigung geändert werden. Falls
diese Dokumentation irgendwelchen Änderungen unterliegt, wird die aktualisierte Version
ohne weitere Hinweise auf der ASRock-Webseite zur Verfügung gestellt. Sollten Sie technische
Hilfe in Bezug auf dieses Motherboard benötigen, erhalten Sie auf unserer Webseite spezischen
Informationen über das von Ihnen verwendete Modell. Auch nden Sie eine aktuelle Liste
unterstützter VGA-Karten und Prozessoren auf der ASRock-Webseite: ASRock-Website http://
www.asrock.com.
26
Deutsch
1.2 Technische Daten
Plattform
Prozessor TM i7/i5/i3/Pentium®/
Celeron® der 6. Generation (Sockel 1151)
Chipsatz
Speicher
ECC, ungepuerter Speicher
* Unterstützt 2 x DDR3/DDR3L-Speichermodule bis 1866 (OC)
und 4 x DDR3/DDR3L-Speichermodule bis 1333
* Weitere Informationen nden Sie in der
Speicherkompatibilitätsliste auf der ASRock-Webseite.
(http://www.asrock.com/)
Erweiter-
ungssteck-
platz
PCIE4:x4-Modus)
* PCI-Karten, die eine subtraktive Dekodierung benötigen,
werden nicht unterstützt.
TM und CrossFireXTM
27
H170 Combo
Deutsch
Grakkarte
Ausgänge können nur mit Prozessoren unterstützt werden, die
GPU-integriert sind.
Intel® Quick Sync Video mit HEVC, AVC, MVC (S3D) und
MPEG-2 Full HW Encode1, Intel® InTru
TM 3D, Intel® Clear
Video HD Technology, Intel® Insider
TM, Intel® HD Graphics
510/530
Ports durch unabhängige Monitor-Controller
(4096x2160) @ 24Hz / (3840x2160) @ 30Hz
bei 60 Hz
bpc), xvYCC und HBR (Audio mit hoher Bitrate) mit HDMI-
Port (konformer HDMI-Monitor erforderlich)
DVI-D- und HDMI-Ports
Audio
Audiocodec)
Protection)
LAN
dung (ASRock Full Spike Protection)
Rückblende,
E/A
28
Deutsch
elektrostatische Entladung (ASRock Full Spike
Protection))
und Geschwindigkeit-LED)
Lautsprecher / Zentral / Bass / Line-in / Vorderer
Lautsprecher /Mikrofon
Speicher
(RAID 0, RAID 1, RAID 5, RAID 10, Intel Rapid Storage
Technology 14 und Intel Smart Response Technology),
NCQ, AHCI und Hot-Plugging
* Anzukündigende Unterstützung
* Wenn M2_1 durch ein SATA-Typ-M.2-Gerät belegt ist, wird
SATA3_0 deaktiviert.
Gb/s-Modul und M.2-PCI-Express-Modul bis Gen3 x 4
(32 Gb/s)
* Unterstützt ASRock U.2-Kit
Anschluss
Lüergeschwindigkeitssteuerung)
Lüergeschwindigkeitssteuerung)
(unterstützt Schutz gegen elektrostatische Entladung
(ASRock Full Spike Protection))
(unterstützt Schutz gegen elektrostatische Entladung
(ASRock Full Spike Protection))
29
H170 Combo
Deutsch
BIOS-Funktion
sprachiger grascher Benutzerschnittstellen
VCCPLL, VCCSA Mehrfachspannungsanpassung
Hard-
wareüberwa-
chung
der Gehäuselüergeschwindigkeit durch CPU-
Temperatur)
DRAM, VPPM, PCH 1,0 V, VCCIO, VCCSA
Betriebssystem
7, 64 Bit
* Zur Installation des Windows® 7-Betriebssystems wird ein
modiziertes Installationslaufwerk mit xHCI-Treibern in der
ISO-Datei benötigt. Detaillierte Anweisungen nden Sie auf
Seite 140.
* Einzelheiten zum aktualisierten Windows® 10-Treiber
entnehmen Sie bitte der ASRock-Webseite:
http://www.asrock.com
Zertizierungen
Bitte beachten Sie, dass mit einer Übertaktung, zu der die Anpassung von BIOS-Einstellungen,
die Anwendung der Untied Overclocking Technology oder die Nutzung von Übertaktung-
swerkzeugen von Drittanbietern zählen, bestimmte Risiken verbunden sind. Eine Übertaktung
kann sich auf die Stabilität Ihres Systems auswirken und sogar Komponenten und Geräte Ihres
Systems beschädigen. Sie sollte auf eigene Gefahr und eigene Kosten durchgeführt werden. Wir
übernehmen keine Verantwortung für mögliche Schäden, die durch eine Übertaktung verursa-
cht wurden.
* Detaillierte Produktinformationen nden Sie auf unserer Webseite: http://www.asrock.com
30
Deutsch
1.3 Jumpereinstellung
Die Abbildung zeigt, wie die Jumper eingestellt werden. Wenn die Jumper-Kappe auf
den Kontakten angebracht ist, ist der Jumper „kurzgeschlossen“. Wenn keine Jumper-
Kappe auf den Kontakten angebracht ist, ist der Jumper „oen“. Die Abbildung zeigt
einen 3-poligen Jumper, dessen Kontakt 1 und Kontakt 2 „kurzgeschlossen“ sind,
wenn eine Jumper-Kappe auf diesen 2 Kontakten angebracht ist.
CMOS-löschen-Jumper
(CLRMOS1)
(siehe S. 1, Nr. 20)
CLRMOS1 ermöglicht Ihnen die Löschung der Daten im CMOS. Zum Löschen
und Rücksetzen der Systemparameter auf die Standardeinrichtung schalten Sie
den Computer bitte ab und ziehen das Netzkabel aus der Steckdose. Warten Sie 15
Sekunde, schließen Sie dann Kontakt 2 und Kontakt 3 an CLRMOS1 5 Sekunden
lang mit einer Jumper-Kappe kurz. Löschen Sie den CMOS jedoch nicht direkt nach
der BIOS-Aktualisierung. Falls Sie den CMOS direkt nach Abschluss der BIOS-
Aktualisierung löschen müssen, starten Sie das System zunächst; fahren Sie es dann
vor der CMOS-Löschung herunter. Bitte beachten Sie, dass Kennwort, Datum, Zeit
und Benutzerstandardprol nur gelöscht werden, wenn die CMOS-Batterie entfernt
wird.
CMOS löschenStandard
31
H170 Combo
Deutsch
1.4 Integrierte Stiftleisten und Anschlüsse
Systemblende-Stileiste
(9-polig, PANEL1)
(siehe S. 1, Nr. 16)
Verbinden Sie
Netzschalter, Reset-Taste
und Systemstatusanzeige
am Gehäuse entsprechend
der nachstehenden
Pinbelegung mit dieser
Stileiste. Beachten Sie vor
Anschließen der Kabel die
positiven und negativen
Kontakte.
GND
R #ESET
PWRBTN#
PLED-
PLED+
GND
HDLED-
HDLED+
1
GND
PWRBTN (Ein-/Austaste):
Mit der Ein-/Austaste an der Frontblende des Gehäuses verbinden. Sie können die Abschaltung
Ihres Systems über die Ein-/Austaste kongurieren.
RESET (Reset-Taste):
Mit der Reset-Taste an der Frontblende des Gehäuses verbinden. Starten Sie den Computer
über die Reset-Taste neu, wenn er abstürzt oder sich nicht normal neu starten lässt.
PLED (Systembetriebs-LED):
Mit der Betriebsstatusanzeige an der Frontblende des Gehäuses verbinden. Die LED leuchtet,
wenn das System läu. Die LED blinkt, wenn sich das System im S1/S3-Ruhezustand bendet.
Die LED ist aus, wenn sich das System im S4-Ruhezustand bendet oder ausgeschaltet ist (S5).
HDLED (Festplattenaktivitäts-LED):
Mit der Festplattenaktivitäts-LED an der Frontblende des Gehäuses verbinden. Die LED
leuchtet, wenn die Festplatte Daten liest oder schreibt.
Das Design der Frontblende kann je nach Gehäuse variieren. Ein Frontblendenmodul besteht
hauptsächlich aus Ein-/Austaste, Reset-Taste, Betrieb-LED, Festplattenaktivität-LED, Lautspre-
cher etc. Stellen Sie beim Anschließen Ihres Frontblendenmoduls an diese Stileiste sicher, dass
Kabel- und Pinbelegung richtig abgestimmt sind.
Integrierte Stileisten und Anschlüsse sind KEINE Jumper. Bringen Sie KEINE Jumper-Kappen
an diesen Stileisten und Anschlüssen an. Durch Anbringen von Jumper-Kappen an diesen
Stileisten und Anschlüssen können Sie das Motherboard dauerha beschädigen.
32
Deutsch
Betrieb-LED- und
Lautsprecher-Stileiste
(7-polig, SPK_PLED1)
(siehe S. 1, Nr. 17)
Bitte verbinden Sie
die Betrieb-LED des
Gehäuses und den
Gehäuselautsprecher mit
dieser Stileiste.
Serial-ATA-III-Anschlüsse
(SATA3_0:
siehe S. 1, Nr. 8)
(SATA3_1:
siehe S. 1, Nr. 10)
(SATA3_2:
siehe S. 1, Nr. 9)
(SATA3_3:
siehe S. 1, Nr. 11)
(SATA3_4:
siehe S. 1, Nr. 15)
(SATA3_5:
siehe S. 1, Nr. 14)
Diese sechs SATA-III-
Anschlüsse unterstützen
SATA-Datenkabel für
interne Speichergeräte mit
einer Datenübertragungsg
eschwindigkeit bis 6,0 Gb/
s. SATA3_0 und SATA3_1
werden gemeinsam mit
SATA_E_1 genutzt.
SATA3_2 und SATA3_3
werden gemeinsam mit
SATA_E_2 genutzt.
* Wenn M2_1 durch ein
SATA-Typ-M.2-Gerät
belegt ist, wird SATA3_0
deaktiviert.
Serial-ATA-Express-
Anschlüsse
(SATA_E_1:
siehe S. 1, Nr. 12)
(SATA_E_2:
siehe S. 1, Nr. 13)
Bitte verbinden Sie
entweder SATA- oder
PCIe-Speichergeräte mit
diesen Anschlüssen.
USB 2.0-Stileisten
(9-polig, USB_9_10)
(siehe S. 1, Nr. 19)
(9-polig, USB_11_12)
(siehe S. 1, Nr. 18)
Es gibt zwei Stileisten an
diesem Motherboard. Jede
USB 2.0-Stileiste kann
zwei Ports unterstützen.
1
+5V
DUMMY
PLED+
PLED+
PLED-
DUMMY
SPEAKER
SATA3_0SATA3_1SATA3_4
SATA3_2SATA3_3SATA3_5
SATA3_0
SATA3_2
SATA3_1
SATA3_3
SATA_E_1
SATA_E_2
DUMMY
GND
GND
P+
P-
U RSB_PW
P+
P-
U RSB_PW
1
33
H170 Combo
Deutsch
USB 3.0-Stileisten
(19-polig, USB_5_6)
(siehe S. 1, Nr. 6)
Neben sechs USB 3.0-Ports
an der E/A-Blende
bendet sich eine Stileiste
an diesem Motherboard.
Diese USB 3.0-Stileiste
unterstützt zwei Ports.
Audiostileiste
(Frontblende)
(9-polig, HD_AUDIO1)
(siehe S. 1, Nr. 24)
Diese Stileiste dient
dem Anschließen von
Audiogeräten an der
Frontblende.
Gehäuselüeranschlüsse
(4-polig, CHA_FAN1)
(siehe S. 1, Nr. 21)
(4-polig, CHA_FAN2)
(siehe S. 1, Nr. 7)
(4-polig, CHA_FAN3)
(siehe S. 1, Nr. 4)
Bitte verbinden Sie die
Lüerkabel mit den
Lüeranschlüssen; der
schwarze Draht gehört
zum Erdungskontakt.
1
IntA_PB_D+
Dummy
IntA_PB_D-
GND
IntA_PB_SSTX+
GND
IntA_PB_SSTX-
IntA_PB_SSRX+
IntA_PB_SSRX-
VbusVbus
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GND
OUT2_R
MIC2_R
MIC2_L
OUT_RET
1. High Denition Audio unterstützt Anschlusserkennung, der Draht am Gehäuse muss dazu
jedoch HDA unterstützt. Bitte befolgen Sie zum Installieren Ihres Systems die Anweisungen
in unserer Anleitung und der Anleitung zum Gehäuse.
2. Bei Nutzung eines AC’97-Audiopanels dieses bitte anhand folgender Schritte an der Audi-
ostileiste der Frontblende installieren:
A. Mic_IN (Mikrofon) mit MIC2_L verbinden.
B. Audio_R (RIN) mit OUT2_R und Audio_L (LIN) mit OUT2_L verbinden.
C. Erde (GND) mit Erde (GND) verbinden.
D. MIC_RET und OUT_RET sind nur für das HD-Audiopanel vorgesehen. Sie müssen sie
nicht für das AC’97-Audiopanel verbinden.
E. Rufen Sie zum Aktivieren des vorderen Mikrofons das „FrontMic (Vorderes Mikro-
fon)“-Register in der Realtek-Systemsteuerung auf und passen „Recording Volume (Aufnah-
melautstärke)“ an.
GN
D
FAN_VOLTAGE
CHA_FAN_SPEED
F
AN_SPEED_CONTROL
GN
D
FAN_VOLTAGE
CHA_FAN_SPEED
F
AN_SPEED_CONTROL
GND
CHA_FAN_SPEED
FAN_SPEED_CONTR
OL
FAN_VOLTAGE
36
Français
1.2 Spécications
Plateforme
Processeur e génération Intel®
CoreTM i7/i5/i3/Pentium®/Celeron® (Socket 1151)
Chipset
Mémoire
DDR4 2133
2.0
DDR3/DDR3L 1866(OC)/1600/1333/1066
* Prend en charge 2 modules mémoire DDR3/DDRL3 jusqu’à
1866(OC), et 4 modules mémoire DDR3/DDRL3 jusqu’à
1333
* Veuillez consulter la liste de prise en charge des mémoires
sur le site Web d'ASRock pour de plus amples informations.
(http://www.asrock.com/)
Fente
d’expansion PCIE4:mode x4)
* Les cartes PCI nécessitant un décodage soustractif ne sont
pas prises en charge.
TM et
CrossFireXTM
Graphiques
sorties VGA sont uniquement prises en charge par les
processeurs intégrant un contrôleur graphique.
39
H170 Combo
Français
Surveil-
lance du
matériel
de la vitesse du ventilateur du châssis d’après la température
du processeur)
châssis
CPU Vcore, DRAM, VPPM, PCH 1,0V, VCCIO, VCCSA
Système
d’exploita-
tion
7 64 bits
* Pour installer Windows® 7, un disque d'installation modié avec
les pilotes xHCI intégrés au chier ISO est requis. Reportez-vous
à la page 140 pour des instructions plus détaillées.
* Pour le pilote mis à jour pour Windows® 10, veuillez visiter le
site Web d'ASRock pour plus de détails: http://www.asrock.com
Certica-
tions
Il est important de signaler que l’overcloking présente certains risques, incluant des modi-
cations du BIOS, l’application d’une technologie d’overclocking déliée et l’utilisation d’outils
d’overclocking développés par des tiers. La stabilité de votre système peut être aectée par ces
pratiques, voire provoquer des dommages aux composants et aux périphériques du système.
L’overclocking se fait à vos risques et périls. Nous ne pourrons en aucun cas être tenus pour
responsables des dommages éventuels provoqués par l’overclocking.
* pour des informations détaillées de nos produits, veuillez visiter notre site: http://www.asrock.com
41
H170 Combo
Français
1.4 Embases et connecteurs de la carte mère
Embase du panneau
système
(PANNEAU1 à 9 broches)
(voir p.1, No.16)
Branchez le bouton de
mise en marche, le bouton
de réinitialisation et le
témoin d’état du système
présents sur le châssis
sur cette embase en
respectant la conguration
des broches illustrée
ci-dessous. Repérez
les broches positive et
négative avant de brancher
les câbles.
GN D
R #ESE T
PW RBT N#
PL E D-
PL E D+
GN D
HDL E D-
HDL E D+
1
GN D
PWRBTN (bouton d’alimentation):
pour brancher le bouton d’alimentation du panneau frontal du châssis. Vous pouvez congurer la
façon dont votre système doit s’arrêter à l’aide du bouton de mise en marche.
RESET (bouton de réinitiélisation):
pour brancher le bouton de réinitialisation du panneau frontal du châssis. Appuyez sur le bouton
de réinitialisation pour redémarrer l’ordinateur en cas de plantage ou de dysfonctionnement au
démarrage.
PLED (LED d’alimentation du système) :
pour brancher le témoin d’état de l’alimentation du panneau frontal du châssis. Le LED est allumé
lorsque le système fonctionne. Le LED clignote lorsque le système se trouve en mode veille S1/S3. Le
LED est éteint lorsque le système se trouve en mode veille S4 ou hors tension (S5).
HDLED (LED d’activité du disque dur) :
pour brancher le témoin LED d’activité du disque dur du panneau frontal du châssis. Le LED est
allumé lorsque le disque dur lit ou écrit des données.
La conception du panneau frontal peut varier en fonction du châssis. Un module de panneau
frontal est principalement composé d’un bouton de mise en marche, bouton de réinitialisation,
LED d’alimentation, LED d’activité du disque dur, haut-parleur etc. Lorsque vous reliez le module
du panneau frontal de votre châssis sur cette embase, veillez à parfaitement faire correspondre les
ls et les broches.
Les embases et connecteurs situés sur la carte NE SONT PAS des cavaliers. Ne placez JAMAIS
de capuchons de cavaliers sur ces embases ou connecteurs. Placer un capuchon de cavalier sur
ces embases ou connecteurs endommagera irrémédiablement votre carte mère.
45
H170 Combo
Italiano
1 Introduzione
Congratulazioni per l’acquisto della scheda madre ASRock H170 Combo, una scheda
madre adabile prodotta secondo i severissimi controlli di qualità ASRock. La scheda
madre ore eccellenti prestazioni con un design robusto che si adatta all'impegno di
ASRock di orire sempre qualità e durata.
1.1 Contenuto della confezione
Dato che le speciche della scheda madre e del soware BIOS possono essere aggiornate, il
contenuto di questa documentazione sarà soggetto a variazioni senza preavviso. Nel caso di
eventuali modiche della presente documentazione, la versione aggiornata sarà disponibile sul
sito Web di ASRock senza ulteriore preavviso. Per il supporto tecnico correlato a questa scheda
madre, visitare il nostro sito Web per informazioni speciche relative al modello attualmente in
uso. È possibile trovare l'elenco di schede VGA più recenti e di supporto di CPU anche sul sito
Web di ASRock. Sito Web di ASRock http://www.asrock.com.
47
H170 Combo
Italiano
Graca
uscite VGA possono essere supportate soltanto con processori
con GPU integrata.
Intel®: Intel® Quick Sync Video con HEVC, AVC, MVC (S3D)
e MPEG-2 Full HW Encode1, Intel® InTru
TM 3D, tecnologia
Intel® Clear Video HD, Intel® Insider
TM, Intel® HD Graphics
510/530
tramite controller display indipendenti
(4096x2160) @ 24Hz / (3840x2160) @ 30Hz
a 60 Hz
xvYCC e HBR (High Bit Rate Audio) con porta HDMI
(è necessario un monitor compatibile HDMI)
porte DVI-D e HDMI
Audio
Realtek ALC892)
ASRock dai picchi di corrente)
LAN
(ESD) (protezione completa ASRock dai picchi di corrente)
I/O
pannello
posteriore
48
Italiano
elettrostatiche (ESD) (protezione completa ASRock dai picchi
di corrente))
LED)
posteriore/centrale/basso/ingresso linea/altoparlante
anteriore/microfono
Archiviazione
RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology 14
e Intel Smart Response Technology), NCQ, AHCI e Hot Plug
* Supporto di prossima comunicazione
* Se M2_1 è occupato da un dispositivo M.2 di tipo SATA,
SATA3_0 sarà disabilitato.
ed il modulo M.2 PCI Express no a Gen3 p50-x4 (32 Gb/s)
* Supporta kit ASRock U.2
Connettore
Control)
Control)
(supporto protezione da scariche elettrostatiche (ESD)
(protezione completa ASRock dai picchi di corrente))
(supporto protezione da scariche elettrostatiche (ESD)
(protezione completa ASRock dai picchi di corrente))
Funzionalità
BIOS multilingue
50
Italiano
1.3 Impostazione jumper
L'illustrazione mostra in che modo vengono impostati i jumper. Quando il cappuccio
del jumper è posizionato sui pin, il jumper è "cortocircuitato". Se sui pin non è
posizionato alcun cappuccio del jumper, il jumper è "aperto". L'illustrazione mostra
un jumper a 3 pin i cui pin1 e pin2 sono "cortocircuitati" quando un cappuccio del
jumper è posizionato su questi 2 pin.
Jumper per azzerare la CMOS
(CLRMOS1)
(vedere pag. 1, n. 20)
CLRMOS1 permette si azzerare i dati nella CMOS. Per azzerare e reimpostare
i parametri del sistema alla congurazione predenita, spegnere il computer e
scollegare il cavo di alimentazione dalla rete. Attendere 15 secondi, quindi usare un
cappuccio jumper per cortocircuitare il pin 2 ed il pin 3 su CLRMOS1 per 5 secondi.
Tuttavia, non azzerare la CMOS subito dopo aver aggiornato il BIOS. Se è necessario
azzerare la CMOS dopo l'aggiornamento del BIOS, è necessario riavviare prima il
sistema e in seguito spegnerlo prima di eseguire l'operazione di azzeramento della
CMOS. La password, la data, l'ora e il prolo predenito dell'utente saranno azzerati
solo se viene rimossa la batteria della CMOS.
Azzerare la CMOS
predenito
59
H170 Combo
Español
Función
del BIOS gráca de usuario multilingüe
PCH 1,0 V, VCCIO, VCCPLL y VCCSA
Monitor
del
hardware
ocidad del ventilador del chasis por temperatura de la CPU)
DRAM, VPPM, PCH 1,0 V, VCCIO y VCCSA
SO
y 7 de 64 bits
* Para instalar el sistema operativo Windows® 7, se necesita un
disco de instalación modicado con los controladores xHCI
empaquetados en el archivo ISO. Consulte la página 140 para
obtener información más detallada.
* Para obtener el controlador actualizado para Windows® 10, visite
el sitio Web desde ASRock para obtener detalles:
http://www.asrock.com
Certica-
ciones
compatible con ErP/EuP)
Tenga en cuenta que existen ciertos riesgos relacionados con el overclocking (sobreaceleración),
incluyendo el ajuste de la conguración del BIOS, aplicando la Tecnología overcloking no
vinculada o utilizando las herramientas de overclocking de tercera parte. El overclocking
podría afectar la estabilidad de su sistema o incluso dañar los componentes y dispositivos de
su sistema. Si lo realiza, todos los riesgos y gastos derivados del overclocking serán de su entera
responsabilidad. No nos hacemos responsables de posibles daños producidos por el overclocking.
* Para obtener más información acerca del producto, visite nuestro sitio web: http://www.asrock.com
Produktspecifikationer
| Varumärke: | Asrock |
| Kategori: | moderkort |
| Modell: | H170 Combo |
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