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Intel® Server System
R1 /000GZ GL Product Family
Technical Product Specification
Revision 2.2
4 May 201
Intel® Server Boards and Systems
Intel® Server System R1000GZ/GL Product Family TPS
Revision History
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January 201 2
1.0
1st Production Release
April 2 012 1.1
• Updated Features Table
• Updated Environmental Limits Table
o Added ASHRAE support details
• Updated thermal management sections
• Updated sections for embedded SCU and RAID support
• s Added section for product errata definition and FRUSDR usage
• -Updated add in card length limits to riser card sections.
• Updated reference documents list
June 2012 1.2
• Corrected LCP front Panel port definition
• Corrected LCP product code
• Added advisory note to AXXVRAIL feature list
• Corrected IO Module product code definitions in Table 1
January 2013 1.3
• Front bezel badge option diagrams added to section 2.5
• Rail Kit Caution and Advisory notes added to section 2.6
• Added DC power supply specification content to chapter 3
• Updated RSTe support sections in chapter 6
• Removed sections in Chapter 8 – LCP support. Added reference to
published LCP TPS
• Corrected Appendix B POST Code LED Decoder - – (E0h – E3h)
• Added Appendix D. System Configuration Table for Thermal Compatibility–
February 2013 1.3.1
• Removed all DC Power Supply content and references
August 2013 2.0
• Added Intel® Xeon® processor E5-2600 v2 product family support.
o Updated Table #1 System Feature Set
o Updated Appendix D
• Updated system rail kit support
February 2014 2.1
• Added DC power supply specification content to chapter 3
• Added sections detailing add-in card support
• Added 2.5” SSD support content to 3.5” drive configurations
• Added volumetric air flow requirements table
May 2014 2.2
• Added DC 750W Gold for Power Supply Options to chapter 2
• Added the Disclaimer Note for the System Environmental Limits Summary
table
• Added the footnote for the Power/Sleep LED Functional States table
• Added the Intel® Xeon® -processor E5 2600 v2 product family support in
Appendix A
• Update Figure 7 – update the jumper location order
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R1000GZ/GL Product Family Disclaimers
Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in
personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION
CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS
AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL
CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF,
DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN
ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR
WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS
PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on
the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to
them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product
order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be
obtained by calling 1 4725, or go to:-800 548- - http://www.intel.com/design/literature.htm
Intel® Xeon® and Intel® s Xeon Phi™ are registered trademark of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2012, 2013, 2014
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Intel® Server System R1000GZ/GL Product Family TPS
Table of Contents
1. Introduction ........................................................................................................................ 1
1.1 Chapter Outline ...................................................................................................... 1
1.2 Server Board Use Disclaimer ................................................................................. 1
1.3 Product Errata ........................................................................................................ 2
2. Product Family Overview ................................................................................................... 3
2.1 Chassis Dimensions ............................................................................................... 5
2.2 System Level Environmental Limits ........................................................................ 6
2.3 System Features and Options Overview ................................................................ 7
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options ............................................... 7
2.3.2 Back Panel Features .............................................................................................. 8
2.3.3 Front Control Panel Options ................................................................................... 8
2.4 Server Board Features Overview ........................................................................... 9
2.5 Available Front Bezel Support .............................................................................. 11
2.6 Available Rack and Cabinet Mounting Kit Options ................................................ 12
3. Power Subsystem ............................................................................................................. 14
3.1 Mechanical Overview ........................................................................................... 14
3.2 Power Connectors ................................................................................................ 16
3.2.1 Power Supply Module Card Edge Connector ....................................................... 16
3.2.2 Riser Card Power Connectors .............................................................................. 16
3.2.3 Hot Swap Backplane Power Connector ................................................................ 17
3.2.4 Optical Drive Power Connector ............................................................................ 17
3.3 Power Supply Module Efficiency .......................................................................... 17
3.4 Power Cord Specification Requirements .............................................................. 18
3.5 Optional Chassis Grounding Support ................................................................... 19
3.6 AC Input Specifications ........................................................................................ 19
3.6.1 Power Factor ........................................................................................................ 19
3.6.2 AC Input Voltage Specification ............................................................................. 19
3.6.3 AC Line Isolation Requirements ........................................................................... 20
3.6.4 AC Line Dropout / Holdup .................................................................................... 20
3.6.5 AC Line Fuse ....................................................................................................... 20
3.6.6 AC Inrush ............................................................................................................. 20
3.6.7 AC Line Transient Specification ...........................................................................20
3.6.8 Susceptibility Requirements ................................................................................. 21
3.6.9 Electrostatic Discharge Susceptibility ................................................................... 21
3.6.10 Fast Transient/Burst ............................................................................................. 21
3.6.11 Radiated Immunity ............................................................................................... 21
3.6.12 Surge Immunity .................................................................................................... 21
3.6.13 Power Recovery ................................................................................................... 21
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List of Tables
Table 1. System Feature Set ...................................................................................................... 4
Table 2. System Environmental Limits Summary ........................................................................ 6
Table 3. Power Supply Module Output Power Connector Pin-out ............................................. 16
Table 4. Riser Slot Power Pin-out ("OPT_12V_PWR_#") ......................................................... 17
Table 5. Hot Swap Backplane Power Connector Pin- out (“HSBP PWR").................................. 17
Table 6. Peripheral Drive Power Connector Pin- out ("ODD/SSD PWR")................................... 17
Table 7. 460 Watt AC Power Supply Efficiency........................................................................ 17
Table 8. 750 Watt AC Power Supply Efficiency ........................................................................17
Table 9 750 Watt DC Power Supply Efficiency (Gold). .............................................................18
Table 10. AC Power Cord Specifications ................................................................................. 18
Table 11 DC Power Cable Connector Pin. -out .......................................................................... 18
Table 12. 460 Watt Power Supply Over Current Protection ..................................................... 22
Table 13. 750 Watt Power Supply Over Current Protection ...................................................... 22
Table 14. Over Voltage Protection (OVP) Limits ...................................................................... 22
Table 15. DC Input Rating ........................................................................................................ 23
Table 16 Line Voltage Transient Limits. .................................................................................... 24
Table 17. Over Current Protection ............................................................................................ 25
Table 18 Over Vol. tagge Protection Limits ................................................................................ 25
Table 19. Example Load Share Threshold for Activating Supplies ........................................... 26
Table 20. LED Indicators .......................................................................................................... 27
Table 22 1U System Volumetric Air Flow Requ. irements .......................................................... 32
Table 23. System Fan Connector Pin-out ................................................................................. 34
Table 24. Drive Status LED States ........................................................................................... 36
Table 25. Drive Activity LED States .......................................................................................... 36
Table 26. Intel® RAID C600 Upgrade Key Options................................................................... 44
Table 27. Supported Intel® Integrated RAID Modules ............................................................... 46
Table 28. System Status LED State Definitions ........................................................................ 49
Table 29. Power/Sleep LED Functional States ......................................................................... 50
Table 30. Riser Slot #1 PCIe Port Routing– ............................................................................. 56
Table 31. Riser Slot #2 PCIe Port Routing– ............................................................................. 57
Table 32. Enabling Advanced Management Features ..............................................................60
Table 33. POST Progress Code LED Example ......................................................................... 62
Table 34. Diagnostic LED POST Code Decoder ....................................................................... 63
Table 35. MRC Progress Codes ............................................................................................... 65
Table 36. MRC Fatal Error Codes ............................................................................................ 66
Table 37. POST Error Messages and Handling ........................................................................ 67
Table 38. Beep CodesPOST Error ........................................................................................... 71
Table 39. BMC Beep CodesIntegrated .................................................................................... 71
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Intel® Server System R1000GZ/GL Product Family TPS
2.2 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 2. System Environmental Limits Summary
Parameter
Limits
Temperature
Operating – ASHRAE Class A2 Continuous Operation. 10º C to 35º C (50º F to 95º F) with the maximum
rate of change not to exceed 10 C per hour°
– ASHRAE Class A3 Includes operation up to 40C for up to 900 hrs per year.
– ASHRAE Class A4 Includes operation up to 45C for up to 90 hrs per year.
-Shipping 40º C to 70º C ( 40º F to 158º F)-
Altitude
Operating Support operation up to 3050m with ASHRAE class deratings.
Humidity
Shipping 50% to 90%, non ndensing with a maximum wet bulb of 28° C (at temperatures from 25° C -co
to 35° C)
Shock
Operating Half sine, 2g, 11 mSec
Unpackaged Trapezoidal, 25 g, velocity change is based on packaged weight
Packaged Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Vibration
Unpackaged 5 Hz to 500 Hz 2.20 g RMS random
Packaged 5 Hz to 500 Hz 1.09 g RMS random
AC- DC
Voltage 90 Hz to 132 V and 180 V to 264 V
Frequency 47 Hz to 63 Hz
Source Interrupt No loss of data for power line drop -out of 12 mSec
-Surge Non
operating and
operating
Unidirectional
Line to earth Only AC Leads 2.0 kV
I/O Leads 1.0 kV
DC Leads 0.5 kV
ESD
Air Discharged 12.0 kV
Contact
Discharge 8.0 kV
Acoustics
Sound Power
Measured
Power in Watts <300 W ≥300 W ≥600 W ≥1000 W
Servers/Rack
Mount BA 7.0 7.0 7.0 7.0
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Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock requirement
mentioned above through its own chassis development and system configuration. It is the responsibility of the
system integrator to determine the proper shock level of the board and system if the system integrator chooses
different system configuration or different chassis. Intel Corporation cannot be held responsible, if components
fail or the server board does not operate correctly when used outside any of its published operating or non-
operating limits.
See Appendix D in this document or the Intel
® P BS2600GZGL Product Family ower udget and Thermal
Configuration Tool for system configuration requirements and limitations.
2.3 System Features and Options Overview
Figure 2 . System Components Overview
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options
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Intel® Server System R1000GZ/GL Product Family TPS
Figure 3 - 4 . 3.5" Hard Drive Bay Drive Configuration
Figure 4 - 8 . 2.5" Hard Drive Bay Drive Configuration
2.3.2 Back Panel Features
Figure 5 . Back Panel Feature Identification
2.3.3 Front Control Panel Options
Label
Description
Label
Description
A System ID Button w/Integrated LED F System Status LED
B NMI Button (recessed, tool required for use) G Power Button w/Integrated LED
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C - H NIC 1 Activity LED Hard Drive Activity LED
D - I - NIC 3 Activity LED NIC 4 Activity LED
E System Cold Reset Button J - NIC 2 Activity LED
Figure 6. Front Control Panel Options
2.4 Server Board Features Overview
The following illustration provides a general overview of the server board, identifying key feature and
component locations. The majority of the items identified are common between the Intel
® Server Board
S2600GL and S2600GZ.
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Intel® Server System R1000GZ/GL Product Family TPS
Figure Intel8. ® -Light Guided Diagnostic LEDs - Server Board
2.5 Available Front Bezel Support
The optional front bezel is made of molded plastic and uses a sn on design. When installed, its design Black ap-
allows for maximum airflow to maintain system cooling requirements. The face of the bezel assembly includes
optional snap-in identification badge and wave (shown) features to allow for customization.
( Intel Product Order Code – ) A1UBEZEL
Figure 9. Front Bezel accessory with optionally installed wave feature
Figure 10. Front Bezel accessory with optionally installed wave and ID badge (1)
Figure 11. Front Bezel accessory with optionally installed wave and ID badge (2)
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Intel® Server System R1000GZ/GL Product Family TPS
3.2 Power Connectors
3.2.1 Power Supply Card Edge Module Connector
Each power supply module has a single 2x25 card edge output connection that plugs directly into a matching
slot connector on the server board. The connector provides both power and communication signals to the
server board. The following table defines the connector pin-out.
Table 3. Power Supply Module Output Power Connector Pin-out
Pin
Name
Pin
Name
A1
GND
B1
GND
A2
GND
B2
GND
A3
GND
B3
GND
A4
GND
B4
GND
A5
GND
B5
GND
A6
GND
B6
GND
A7
GND
B7
GND
A8
GND
B8
GND
A9
GND
B9
GND
A10
+12V
B10
+12V
A11
+12V
B11
+12V
A12
+12V
B12
+12V
A13
+12V
B13
+12V
A14
+12V
B14
+12V
A15
+12V
B15
+12V
A16
+12V
B16
+12V
A17
+12V
B17
+12V
A18
+12V
B18
+12V
A19
PMBus SDA
B19
A0 (SMBus address)
A20
PMBus SCL
B20
A1 (SMBus address)
A21
PSON
B21
12V stby
A22
SMBAlert#
B22
Cold Redundancy Bus
A23
Return Sense
B23
12V load share bus
A24
+12V remote Sense
B24
No Connect
A25
PWOK
B25
Compatibility Check pin*
The server board provides several connectors to provide power to various system options. The following sub-
sections will identify the location; provide the pin out definition; and provide a brief usage description for each. -
3.2.2 Riser Card Power Connectors
The serve board includes two white 2x2 pin power connectors that provide supplemental power to high power r -
PCIe x16 in cards that have power requirements that exceed the maximum power supplied by add- ( ) GPU 75W
the PCIe x16 riser slot. A cable from this connector may be routed power connector on the given add to a -in
card. Maximum power draw for each connector is 225W, but is also limited by a provided by the vailable power
power supply and the total power draw the rest of the system. A power budget for the complete system of
should be performed to determine how much supplemental power is available to support any high power add-
in cards.
Note: Intel® -Xeon Phi™ Coprocessor and non Intel GPGPU add-in cards cannot be supported in a 1U server
system.
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3.6.14 Voltage Interruptions
The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000 03-4- 11: Second Edition: 2004- test standard and performance criteria C defined in Annex B of CISPR
24.
3.6.15 Protection Circuits
Protection circuits inside the power supply cause only the power supply’s main outputs to shut down.
If the
power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON
#
cycle HIGH for one second reset the power supply.
3.6.16 - Over current Protection (OCP)
The power supply shall have current limit to prevent the outputs from exceeding the values shown in table
below. If the current limits are exceeded the power supply shall shutdown and latch off. The latch will be
cleared by toggling the PSON
# signal or by an AC power interruption. The power supply shall not be damaged
from repeated power cycling in this condition. 12VSB will be auto recovered after removing- OCP limit.
Table 12 Watt. 460 Power Supply Over Current Protection
Output Voltage
Input voltage range
Over Current Limits
+12V
90 – 264VAC
47A min; 55A max
12VSB
90 – 264VAC
2A min; 2.5A max
Table 13. 750 Watt Power Supply Over Current Protection
Output Voltage
Input voltage range
Over Current Limits
+12V
90 – 264VAC
72A min; 78A max
12VSB
90 – 264VAC
2.5A min; 3.5A max
3.6.17 - Over voltage Protection (OVP)
The power supply over voltage protection shall be locally sensed. The power supply shall shutdown and latch
off after an over voltage condition occurs. This latch shall be cleared by toggling the PSON
# signal or by an
AC power interruption. The values are measured at the output of the power supply’s connectors. The voltage
shall never exceed the maximum levels when measured at the power connectors of the power supply
connector during any single point of fail. The voltage shall never trip any lower than the minimum levels when
measured at the power connector. 12VSB will be auto recovered after removing OVP limit.-
Table 14. Over Voltage Protection (OVP) Limits
Output Voltage
MIN (V)
MAX (V)
+12V
13.3
14.5
+12VSB
13.3
14.5
3.6.18 - Over temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an OTP condition the PSU will shutdown. When the power supply
temperature drops to within specified limits, the power supply shall restore power automatically, while the
12VSB remains always on. The OTP circuit must have built in margin such that the power supply will not
oscillate on and off due to temperature recovering condition. The OTP trip level shall have a minimum of 4°C
of ambient temperature margin.
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or out of regulation conditions, but shall not damage the power supply. The power supply should recover and
meet all turn on requirements for DC dropouts that last longer than . The power supply must meet the 0.2ms
DC dropout requirement over rated DC voltages and output loading conditions.
3.7.6 DC Line Surge Voltages (Line Transients)
The Power Supply should demonstrate tolerance for transients in the input DC power line caused by switching
or lightning. The power supply shall be primarily tested and must be compliant with the requirements of
EN61000-4-5: “Electrical Fast transients / Burst Requirements and Surge Immunity Requirements” for surge
withstand capability. The test voltage surge levels are to be: 500Vpk for each Line to Primary Earth Ground
test (none required between the L1 and L2). The exact description can be found in Intel Environmental
Standards Handbook 2001.
Table 16. Line Voltage Transient Limits
Duration
Slope/Rate
Output
Performance criteria
200µs max
- -48V → 30V
w/ +2V/µs Rated DC Voltages No loss of function or performance
- -30V → 48V
w/ - 2V/µs Rated DC Voltages No loss of function or performance
3.7.7 Susceptibility Requirements
The power supply shall meet the following electrical immunity requirements when connected to a cage with an
external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification. For
further information on Intel standards please request a copy of the Intel Environmental Standards Handbook.
Level
Description
A
The apparatus shall continue to operate as intended. No degradation of
performance.
B
The apparatus shall continue to operate as intended. No degradation of
performance beyond spec limits.
C
Temporary loss of function is allowed provided the function is self-
recoverable or can be restored by the operation of the controls.
3.7.7.1 Electrostatic Discharge Susceptibility
The power supply shall comply with the limits defined in EN 55024: 1998 using the IEC 61000-4-2:1995 test
standard and performance criteria B defined in Annex B of CISPR 24. Limits shall comply with those specified
in the Intel Environmental Standards Handbook.
3.7.7.2 Fast Transient/Burst
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000 4:1995 te-4- st
standard and performance criteria B defined in Annex B of CISPR 24. . Limits shall comply with those specified
in the Intel Environmental Standards Handbook.
3.7.7.3 Radiated Immunity
The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-4-3:1995 test standard and
performance criteria A defined in Annex B of CISPR 24. . Limits shall comply with those specified in the Intel
Environmental Standards Handbook. Additionally, must also comply with field strength requirements specified in GR 1089
(10V/meter).
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3.8 Cold Redundancy Support
Power supplies that support cold redundancy can be enabled to go into a low-power state (that is, cold
redundant state) in order to provide increased power usage efficiency when system loads are such that both
power supplies are not needed. When the power subsystem is in Cold Redundant mode, only the needed
power supply to support the best power delivery efficiency is ON. Any additional power supplies; including the
redundant power supply, is in Cold Standby state
Each power supply has an additional signal that is dedicated to supporting Cold Redundancy; CR_BUS. This
signal is a common bus between all power supplies in the system. CR_BUS is asserted when there is a fault in
any power supply OR the power supplies output voltage falls below the Vfault threshold. Asserting the
CR_BUS signal causes all power supplies in Cold Standby state to power ON.
Enabling power supplies to maintain best efficiency is achieved by looking at the Load Share bus voltage and
comparing it to a programmed voltage level via a PMBus command.
Whenever there is no active power supply on the Cold Redundancy bus driving a HIGH level on the bus all
power supplies are ON no matter their defined Cold Redundant roll (active or Cold Standby). This guarantees
that incorrect programming of the Cold Redundancy states of the power supply will never cause the power
subsystem to shutdown or become over loaded. The default state of the power subsystem is all power
supplies ON. There needs to be at least one power supply in Cold Redundant Active state or Standard
Redundant state to allow the Cold Standby state power supplies to go into Cold Standby state.
3.8.1 Powering on Cold Standby supplies to maintain best efficiency
Power supplies in Cold Standby state shall monitor the shared voltage level of the load share signal to sense
when it needs to power on. Depending upon which position (1, 2, or 3) the system defines that power supply
to be in the cold standby configuration; will slightly change the load share threshold that the power supply shall
power on at.
Table 19. Example Load Share Threshold for Activating Supplies
Enable Threshold for
VCR_ON_EN Disable Threshold for
VCR_ON_DIS CR_BUS De-asserted / Asserted
States
Standard
Redundancy NA; Ignore dc/dc_ active# signal; power supply is always
ON OK = High
Fault = Low
Cold Redundant
Active NA; Ignore dc/dc_ active# signal; power supply is always
ON OK = High
Fault = Low
Cold Standby 1
(02h) 3.2V (40% of max) 3.2V x 0.5 x 0.9 = 1.44V OK = Open
Fault = Low
Cold Standby 2
(03h) 5.0V (62% of max) 5.0V x 0.67 x 0.9 = 3.01V OK = Open
Fault = Low
Cold Standby 3
(04h) 6.7V (84% of max) 6.7V x 0.75 x 0.9 = 4.52V OK = Open
Fault = Low
Notes:
Maximum load share voltage = 8.0V at 100% of rated output power
These are example load share bus thresholds; for a given power supply, these shall be customized to maintain
the best efficiency curve for that specific model.
3.8.2 Powering on Cold Standby supplies during a fault or over current condition
When an active power supply asserts its CR_BUS signal (pulling it low), all parallel power supplies in cold
standby mode shall power on within 100μsec
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Produktspecifikationer
| Varumärke: | Intel |
| Kategori: | Server |
| Modell: | R1304GL4DS9 |
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