Supermicro SuperServer SSG-620P-ACR16H Bruksanvisning

Supermicro Inte kategoriserad SuperServer SSG-620P-ACR16H

Läs nedan 📖 manual på svenska för Supermicro SuperServer SSG-620P-ACR16H (117 sidor) i kategorin Inte kategoriserad. Denna guide var användbar för 8 personer och betygsatt med 4.5 stjärnor i genomsnitt av 2 användare

Sida 1/117
USER’S MANUAL
Revision 1.0
SuperServer®
620P-ACR16H
620P-ACR16L
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in industrial environment for Class A device or in residential
environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with
radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in
which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See ”.www.dtsc.ca.gov/hazardouswaste/perchlorate
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0
Release Date: September 10, 2021 vc
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2021 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
3
Preface
3
Preface
Preface
About this Manual
This manual is written for professional system integrators and PC technicians. It provides
information for the installation and use of the server. Installation and maintenance should be
performed by experienced technicians only.
Please refer to the 620P-ACR16(H/L) server specications page on our website for updates
on supported memory, processors and operating systems (http://www. supermicro. com).
Notes
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
Supermicro product manuals: http://www.supermicro.com/support/manuals/
Product drivers and utilities: https://www.supermicro.com/wdl/driver
Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
If you have any questions, please contact our support team at:
support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
Secure Data Deletion
A secure data deletion tool designed to fully erase all data from storage devices can be found
on our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wdl/utility/
Lot9_Secure_Data_Deletion_Utility/
Warnings
Special attention should be given to the following symbols used in this manual.
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
4
Contents
Contents
Chapter 1 Introduction
1.1 Overview ...............................................................................................................................9
Models .................................................................................................................................9
1.2 System Features ................................................................................................................10
Front View .........................................................................................................................10
Drive Carrier Indicators ..................................................................................................10
Control Panel .................................................................................................................11
Rear View ..........................................................................................................................12
Power Supply Indicator ..................................................................................................13
1.3 System Architecture ...........................................................................................................14
1.4 Motherboard Layout ...........................................................................................................16
Quick Reference Table ......................................................................................................17
Motherboard Block Diagram .............................................................................................19
Chapter 2 Server Installation
2.1 Overview .............................................................................................................................20
2.2 Unpacking the System .......................................................................................................20
2.3 Preparing for Setup ............................................................................................................20
Choosing a Setup Location ...............................................................................................20
Rack Precautions ..............................................................................................................21
Server Precautions ............................................................................................................21
Rack Mounting Considerations .........................................................................................21
Ambient Operating Temperature ....................................................................................21
Airow ............................................................................................................................22
Mechanical Loading .......................................................................................................22
Circuit Overloading ........................................................................................................22
Reliable Ground .............................................................................................................22
2.4 Installing the Rails ..............................................................................................................23
Identifying the Rails ...........................................................................................................23
Releasing the Inner Rail....................................................................................................24
Installing the Inner Rails on the Chassis ..........................................................................25
Installing the Outer Rails onto the Rack ...........................................................................26
2.5 Installing the Chassis into a Rack ......................................................................................27
5
Contents
Removing the Chassis from the Rack ..............................................................................28
Chapter 3 Maintenance and Component Installation
3.1 Removing Power ...............................................................................................................29
3.2 Accessing the System ........................................................................................................30
3.3 Processor and Heatsink Installation ...................................................................................32
The Processor Carrier Assembly ......................................................................................33
The Processor Heatsink Module (PHM) ...........................................................................35
Installing the PHM into the CPU Socket ...........................................................................36
Removing the PHM from the CPU Socket .......................................................................39
Removing the Processor Carrier Assembly from the PHM ..............................................40
Removing the Processor from the Carrier Assembly........................................................41
3.4 Memory ...............................................................................................................................42
Memory Support ................................................................................................................42
Optane PMem Population .................................................................................................44
PMem Notes ..................................................................................................................44
Memory Population Guidelines .........................................................................................45
Guidelines Regarding Mixing DIMMs ............................................................................45
DIMM Construction ........................................................................................................45
Installing Memory ...........................................................................................................46
3.5 Motherboard Battery ...........................................................................................................47
3.6 Storage Drives ....................................................................................................................48
Installing Drives .................................................................................................................48
Hard Drive Carrier Indicators .........................................................................................50
Internal 3.5" Hard Drives ...................................................................................................51
3.7 System Cooling ..................................................................................................................55
Installing the Air Shroud ................................................................................................56
3.8 Power Supply .....................................................................................................................57
Power Supply LEDs ..........................................................................................................57
3.9 PCI Expansion Cards ........................................................................................................59
3.10 Cable Routing Diagram .....................................................................................................60
Chapter 4 Motherboard Connections
4.1 Input/Output Ports ..............................................................................................................61
4.2 Power Connections ............................................................................................................62
4.3 Headers and Connectors ...................................................................................................62
Control Panel .................................................................................................................66
6
Contents
4.4 Jumpers ..............................................................................................................................69
4.5 LED Indicators ....................................................................................................................70
Chapter 5 Software
5.1 Microsoft Windows OS Installation .....................................................................................71
5.2 Driver Installation ................................................................................................................73
5.3 SuperDoctor® 5 ...................................................................................................................74
5.4 BMC ....................................................................................................................................75
BMC ADMIN User Password ............................................................................................75
Chapter 6 Optional Components
6.1 Additional Storage Drives ...................................................................................................76
6.2 Storage Control Card and Cable(s) ...................................................................................76
6.3 TPM Security Module .........................................................................................................77
6.4 Intel Virtual RAID on CPU (VROC) ....................................................................................78
Requirements and Restrictions .........................................................................................78
Supported SSDs and Operating Sytems ..........................................................................78
Additional Information .......................................................................................................79
Hardware Key ...................................................................................................................79
Conguring NVMe RAID Manually ....................................................................................80
Status Indications ..............................................................................................................85
Hot Swap Drives ...............................................................................................................85
Hot-unplug .....................................................................................................................85
Hot-plug .........................................................................................................................85
Related Information Links .................................................................................................85
Chapter 7 Troubleshooting and Support
7.1 Information Resources ........................................................................................................86
Website .............................................................................................................................86
Direct Links for the 620P-ACR16(H/L) System .............................................................86
Direct Links for General Support and Information .......................................................86
7.2 Baseboard Management Controller (BMC) .........................................................................87
7.3 Troubleshooting Procedures .............................................................................................88
No Power ..........................................................................................................................88
No Video ...........................................................................................................................89
System Boot Failure .........................................................................................................89
Memory Errors ..................................................................................................................89
Losing the System Setup Conguration ...........................................................................89
7
Contents
When the System Becomes Unstable ..............................................................................89
7.4 Crash Dump Using BMC .....................................................................................................91
7.5 CMOS Clear .......................................................................................................................92
7.6 BMC Reset .........................................................................................................................92
7.7 Where to Get Replacement Components ..........................................................................93
7.8 Reporting an Issue .............................................................................................................93
Technical Support Procedures ..........................................................................................93
Returning Merchandise for Service ...................................................................................93
Vendor Support Filing System ..........................................................................................94
7.9 Feedback ............................................................................................................................94
7.10 Contacting Supermicro ......................................................................................................95
Appendix A Standardized Warning Statements for AC Systems
Appendix B System Specications
8
Contacting Supermicro
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
9
Chapter 1: Introduction
Chapter 1
Introduction
1.1 Overview
This chapter provides an outline of the functions and features of the SuperStorage server
620P-ACR16(H/L). The following provides an overview of the specications and capabilities.
System Overview
Motherboard X12DPi-N(T)6
Chassis CSE-829HE1C4-R1K62LPB
Processors 3rd Gen Intel Xeon Scalable in P+ (LGA-4189) socket
Memory 16 DIMM Slots up to 4TB of DDR4 ECC RDIMM/LRDIMM/LRDIMM 3DS with speeds up to
3200MHz
Storage 16 x 3.5" hot-swap SATA/SAS hybrid drive bays
One M.2 NVMe
Expansion Slots Four PCIe 4.0 x16 low prole
Two PCIe 4.0 x8 low prole (see Section 3.10 for details)
I/O Ports
LAN: Two RJ45 10G BASE-T; one RJ45 dedicated BMC LAN port
USB: Four USB 3.0 ports (Rear)
One VGA port (Rear)
One COM port (Rear)
Two Super DOM (Disk on Module) ports
System Cooling Four heavy duty 8cm fans with optimal Fan Speed Control
One air shroud
Power Two redundant 1600W power supplies, 80Plus Titanium level
Form Factor 2U; (WxHxD) 17.3 x 3.5 x 27.8 in. (439 x 89 x 706 mm)
A Quick Reference Guide can be found on the product page of the Supermicro website.
The following safety models associated with the 620P-ACR16(H/L) have been certied as
compliant with UL or CSA: 829-16, 829H-R16X12, and 829H-16.
Models
620P-ACR16H includes the Broadcom S39xx HW RAID card.
620P-ACR16L includes the Broadcom S38xx IT mode card.
10
Chapter 1: Introduction
1.2 System Features
The following views of the system display the main features.
Front View
Figure 1-1. Front View
Logical Storage Drive Numbers
Item Description
0-3 Four 3.5" hot-swap SAS3/SATA/NVMe** hybrid drive bays
4-15 12 x3.5" hot-swap SAS3/SATA drive bays
**NVMe support requires additional parts in optional part list.
Drive Carrier Indicators
Each drive carrier has two LED indicators: an activity indicator and a status indicator. For RAID
congurations using a controller, the meaning of the status indicator is described in the table
below. For OS RAID or non-RAID congurations, some LED indications are not supported,
such as hot spare. For VROC congurations, refer to the VROC section in this manual.
Drive Carrier LED Indicators
Color Blinking Pattern Behavior for Device
Activity
LED
Blue Solid On Idle SAS/NVMe drive installed
Blue Blinking I/O activity
O󰀨 Idle SATA drive installed
Status
LED
Red Solid On Failure of drive with RSTe support
Red Blinking at 1 Hz Rebuild drive with RSTe support
Red Blinking with two blinks
and one stop at 1 Hz
Hot spare for drive with RSTe support
Red On for ve seconds,
then o󰀨
Power on for drive with RSTe support
Red Blinking at 4 Hz Identify drive with RSTe support
Green Solid on Safe to remove NVMe drive
Amber Blinking at 1Hz Do not remove NVMe drive
Service/Asset Tag
with BMC Password
10
11
9
8
7
6
5
4
Control Panel
0
1
2
3
11
Chapter 1: Introduction
Control Panel Features
Feature Description
Power button The main power switch applies or removes primary power from the power supply to the server
but maintains standby power.
Reset Button Reboots the system
Power LED Indicates power is being supplied to the system power supply units. This
LED is illuminated when the system is operating normally.
HDD Indicates activity on the storage drives when ashing.
NIC LEDs Indicates network activity on LANs when ashing.
Power Fail LED Indicates a power supply module has failed.
Information LED Alerts operator to several states, as noted in the table below.
Information LED
Color, Status Description
Red, continuously An overheat condition has occurred.
Red, blinking at 1Hz Fan failure, check for an inoperative fan.
Red, blinking at 0.25Hz Power failure, check for a non-operational power
supply.
Blue, solid UID has been activated locally to locate the
server in a rack environment.
Blue, blinking UID has been activated using the BMC to locate
the server in a rack environment.
Control Panel
Figure 1-2. Control Panel
Power
Power LED
Information LED
HDD
NIC LED
Reset
NIC LED
Power Fail LED
12
Chapter 1: Introduction
Rear View
Figure 1-3. System: Rear View
Expansion Card Chassis Slots
Item Description
1PCIe 4.0x8 low-prole slot (Occupied by 3916 SAS 620P-ACR16H controller or 3816 SAS
620P-ACR16L controller)
23PCIe 4.0x16 low-prole slot
45PCIe 4.0x16 low-prole slot
6PCIe 4.0x8 low-prole slot
System Features: Rear
Feature Description
Power Supplies Two redundant power supply modules, PWS1 on the bottom, PWS2 on the top
Drives Two optional 2.5" hot-swap storage drives, SATA or NVMe
BMC Dedicated LAN port for BMC; for indicator details, see BMC LAN LEDs
USB Four USB 3.2 ports
LAN Two 10G BASE-T ports
VGA One video port
UID Switch/LED
The unit identication (UID) button turns on or o󰀨 the blue light function of the Information
LED and this blue LED on the rear of the chassis.
This button can also be used to reset the BMC.
Power Supplies
USB 3.2
BMC
VGA
Port UID Switch
Drives
LAN
Ports
1
2
Serial
Port
34
5
6
13
Chapter 1: Introduction
Power Supply Indicator
Power Supply Indicator
LED Color and State Power Supply Condition
O󰀨 No AC power to modules
Amber, solid AC cord unplugged and in redundant mode OR power supply critical events causing
a shutdown, failure, OCP, OVP, fan fail, OTP, UVP
Amber, blinking Power supply warning events where the power supply continues to operate: high
temperature, over voltage, under voltage, etc
Green, blinking AC present, only 12vsb on (module o󰀨)
Green, solid Output on, functioning normally
15
Chapter 1: Introduction
System Features: Top
Feature Description
Power Supply Dual redundant modules
DIMM Slots 16 DIMM memory slots
Processors 3rd Gen Intel Xeon Scalable with heatsinks
Drive Bays Four 3.5" hot-swap top loading drive bays
System Fans Four 8-cm fans with Optimal Fan Speed Control, FAN-0166L4
Storage Backplanes BPN-SAS3-829HA-A4 and BPN-SAS3-LA26-N12
Motherboard X12DPi-N(T)6
16
Chapter 1: Introduction
Figure 1-5. Motherboard Layout
1.4 Motherboard Layout
Below is a layout of the X12DPi-N(T)6 motherboard with jumper, connector and LED locations
shown. See the table on the following page for descriptions. For detailed descriptions, pinout
information and jumper settings, refer to Chapter 4 Motherboard Manual or the .
C
MAC CODE
BIOS
LICENSE
BMC CODE
JS3 JS1
BMC
BMC
Firmware
BIOS
JM2_1
JF1
LAN1
LAN2
FAN3FAN4
JUSBRJ45
JNCSI
JUIDB1
FANB
FANA
FAN6
FAN2FAN1
JPI2C1
LE4
LE6
JRK1
(Front) VGA
JBT1
JSTBY1
JPME1JIPMB1
JNVI2C
JPWR4
JPWR2
S-SGPIO
SATA5
SATA6
JPWR3
JLAN2
JLAN1
UID LED
JS2
M.2 Slot
TPM/Port80
PCH
LED
PWR
BMC Heartbeat LED
BMC_LAN/USB7/8(3.0)
P1_NVME2/3
P1_NVME0/1
I-SATA0~3 I-SATA4~7
USB6(3.0) USB4/5(3.0)
USB2/3
(3.0)
USB0/1
(2.0)
S-SATA4S-SATA5
S-SATA0~3
VGA
COM2
COM1
CMOS CLEAR
UID/BMC
P1-DIMMG1
P1-DIMMF1
P1-DIMME1
P1-DIMMH1
P2-DIMMG1
P2-DIMME1
P2-DIMMF1
P2-DIMMH1
CPU2
CPU1
CPU1 SLOT1 PCIe 4.0 X8
CPU1 SLOT2 PCIe 4.0 X16
CPU1 SLOT3 PCIe 4.0 X16
CPU2 SLOT4 PCIe 4.0 X16
CPU2 SLOT5 PCIe 4.0 X16
CPU2 SLOT6 PCIe 4.0 X8
P1-DIMMB1
P1-DIMMA1
P1-DIMMD1
P1-DIMMC1
P2-DIMMC1
P2-DIMMD1
P2-DIMMB1
P2-DIMMA1
LE3
JL1
BAR CODE
VROC
JVGA
JFP2
LAN CTRL2
JTPM-1
RAID KEY-1
Front Panel CTRL
P2-DIMMB2
P1-DIMMB2
CPLD
FAN5
REV:1.00
X12DPi-N(T)6
LAN CTRL1
(*X12DPI-N6)
X12DPI-NT6
BT1
Battery
Reset
MH15 MH16
NVME
JPL1
LEDM1
JPWR4
P2-DIMMC1
JF1
JPWR2
LE3
JPWR3
P2-DIMMD1
P2-DIMMA1
P2-DIMMB1
P2-DIMMG1
P2-DIMMH1
P2-DIMME1
P2-DIMMF1
JIPMB1
USB6 (3.0)
M.2
JL1
COM2
JPME1
Battery
S-SGPIO
S-SATA0-3
JNVI2C
USB0/1 (2.0)
USB4/5 (3.0)
LE4
BIOS
JTPM1
I-SATA0-3
I-SATA4-7
Front VGA
(JFP2)
Clear CMOS
LE6 BMC_LAN
USB7/8(3.0)
LAN2
USB2/3(3.0)
LAN1
COM1
VGA
FAN5
FAN4
FANA
VROC(JRK1)
P1_NVME2/3
S-SATA4
JNCSI
UID/BMC Reset
FAN2
JPI2C1
Slot4
LEDM1
Slot3
Slot1
FANB
JSTBY1
Slot6
LANCTRL2 (X12DPi-N6)
FAN6
Slot5
Slot2
S-SATA5
FAN3
P1-DIMMG1
P1-DIMMF1
P1-DIMMH1
P1-DIMME1
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
P1-DIMMD1
FAN1
P1-DIMMB2
P2-DIMMB2
LANCTRL1 (X12DPi-NT6)
P1_NVME0/1
JPL1
MH15
MH16
18
Chapter 1: Introduction
Note: For details on how to congure Network Interface Card (NIC) settings, please refer to
the Network Interface Card Conguration User's Guide posted on our website under the link:
http://www.supermicro.com/support/manuals/.
SLOT6 PCIe 4.0 x8 slot supported by CPU2
S-SGPIO Serial link general purpose I/O connection header (for S-SATA4/5 SuperDOM support)
USB0/1 (2.0) Front-accessible USB header with support for two USB 2.0 ports
USB2/3, USB7/8 (3.0) Rear I/O USB 3.0 ports
USB4/5 (3.0) Front-accessible USB header with support for two USB 3.0 ports
USB6 Internal Type A USB 3.0 port
UID LED/BMC Reset (JUIDB1) Unit Identier (UID) LED and BMC reset switch
VGA (JFP2) Front VGA header
VGA (JVGA) Rear VGA port on the I/O back panel
VROC (JRK1) Intel VROC key header for NVMe RAID support (see Note below.)
Note: For detailed instructions on how to congure VROC RAID settings, please refer
to the VROC RAID Conguration User's Guide posted on the web page under the link:
http:// www. supermicro.com/support/manuals/.
19
Chapter 1: Introduction
Figure 1-6. Motherboard Block Diagram
Motherboard Block Diagram
PCIe X8
12~15
0~7PCIe X8 G4
PCIe X4 G4
SLOT 1
USB 2.0
M.2
PCIe X4
8~11
8~15
0~7
JNVME1
USB 2.0
#10
DDR4
P1
DDR4
2666/2933/3200
2666/2933/3200
DMI2
CPU2-E1
#8
SlimSAS
PCIe GEN4 X16
R FS- -CGTL8211 VS
DDR4
#14
#1
PCIe GEN4 X16
#1
CPU2-G1
P2
SlimSAS
CPLD
(PFR)
DDR4
PCIe X16
DDR4
PCIe TWO X4 G4
DDR4
2666/2933/3200
CPU1-A1
DDR4
2666/2933/3200
SPI
#3
PCIe GEN4 X16
PCIe X1 G2
DMI2
2666/2933/3200
2666/2933/3200
#0
#5
#4
PCIe GEN4 X16
CPU1-C1
#3
BIOS
#2
#2
2666/2933/3200
SPI
DDR4
PCIe GEN4 X16
PCIe GEN4 X8
P0
SLOT 5
ESPI
DDR4
CPU1-F1
DDR4
PCIe X16 G4
PCIe TWO X4 G4
SATA
PCH
X12DPi-N(T)6
#11
SLOT 6
PECI:31
#12
#1
L 3 ( C )AN To MM
W83773G *2 (RT1/RT2)
2666/2933/3200
2666/2933/3200
PCIe X16
DDR4
CPU2-C1
BMC
PCIe X8 G4
CPU2-F1
SPI
CPU1
CPU2-A1
UPI
SPI
2666/2933/3200
PCIe GEN4 X16
#0
#5
PCIe X16 G4
CPU2-D1
RGRMII
2666/2933/3200
CPU2-H1
AST 0260
#10 USB2.0
DMI2
PCIe X16 G4
0~7
CPU1-G1
DDR4
2666/2933/3200
DDR4
2666/2933/3200
PCIe X16 G4
PCIe X8
USB 3.0
CPU2
#13
SLOT 4
2666/2933/3200
CPU1-E1
CPLD
FLASH
BMC B t Fl hoo as
DDR4
2666/2933/3200
DMI X4
USB
Temperature Sensor
UPI
CPU1-D1
6.0 Gb/S
#2
SPI
CPU1-H1
#6
#3
DDR4
PCIe X16
#7
SLOT 2
SLOT 3
P0
SATA0-2
SSATA0
TPM HE ERAD
DDR4
#9
DDR4
Debug Card
DDR4
2666/2933/3200
CPU1-B1
CPU2-B1
DDR4
PCIe X16
USB
LAN CTRL1
X550 (
10G LAN)
JNVME2
PCIe X4 G4
(Socket ID:0) (Socket ID:1)
PECI:30
UPI
P2
P1
CPU1-B2
CPU2-B2
LAN CTRL2
i 0 (35
1G LAN)
(*
for X12DPi-N6
)
(*
for X12DPi-NT6
)
Reserved for Optane
PMem 200 Series*
Reserved for Optane
PMem 200 Series*
20
Chapter 2: Server Installation
Chapter 2
Server Installation
2.1 Overview
This chapter provides advice and instructions for mounting your system in a server rack.
If your system is not already fully integrated with processors, system memory etc., refer to
Chapter 3 for details on installing those specic components.
Caution: Electrostatic Discharge (ESD) can damage electronic components. To prevent such
damage to PCBs (printed circuit boards), it is important to use a grounded wrist strap, handle
all PCBs by their edges and keep them in anti-static bags when not in use.
2.2 Unpacking the System
Inspect the box in which the system was shipped, and note if it was damaged. If any equipment
appears damaged, le a claim with the carrier.
Decide on a suitable location for the rack unit that will hold the server. It should be situated
in a clean, dust-free area that is well ventilated. Avoid areas where heat, electrical noise and
electromagnetic elds are generated. It will also require a grounded AC power outlet nearby.
Be sure to read the precautions and considerations noted in Appendix A.
2.3 Preparing for Setup
The box in which the system was shipped should include the rackmount hardware needed to
install it into the rack. Please read this section in its entirety before you begin the installation.
Choosing a Setup Location
The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas
where heat, electrical noise and electromagnetic elds are generated.
Leave enough clearance in front of the rack so that you can open the front door completely
(~25 inches) and approximately 30 inches of clearance in the back of the rack to allow
su󰀩cient space for airow and access when servicing.
This product should be installed only in a Restricted Access Location (dedicated equipment
rooms, service closets, etc.).
21
Chapter 2: Server Installation
This product is not suitable for use with visual display workplace devices according to §2
of the German Ordinance for Work with Visual Display Units.
Rack Precautions
Ensure that the leveling jacks on the bottom of the rack are extended to the oor so that
the full weight of the rack rests on them.
In single rack installations, stabilizers should be attached to the rack. In multiple rack in-
stallations, the racks should be coupled together.
Always make sure the rack is stable before extending a server or other component from
the rack.
You should extend only one server or component at a time - extending two or more simul-
taneously may cause the rack to become unstable.
Do not use a two-post "telco" type rack for 2U or larger servers.
Server Precautions
Review the electrical and general safety precautions in Appendix A.
Determine the placement of each component in the rack you install the rails.before
Install the heaviest server components at the bottom of the rack rst and then work your
way up.
Use a regulating uninterruptible power supply (UPS) to protect the server from power
surges and voltage spikes and to keep your system operating in case of a power failure.
Allow any drives and power supply modules to cool before touching them.
When not servicing, always keep the front door of the rack and all covers/panels on the
servers closed to maintain proper cooling.
Rack Mounting Considerations
Ambient Operating Temperature
If installed in a closed or multi-unit rack assembly, the ambient operating temperature of
the rack environment may be greater than the room's ambient temperature. Therefore,
consideration should be given to installing the equipment in an environment compatible with
the manufacturer’s maximum rated ambient temperature (TMRA).
22
Chapter 2: Server Installation
Airow
Equipment should be mounted into a rack so that the amount of airow required for safe
operation is not compromised.
Mechanical Loading
Equipment should be mounted into a rack so that a hazardous condition does not arise due
to uneven mechanical loading.
Circuit Overloading
Consideration should be given to the connection of the equipment to the power supply circuitry
and the e󰀨ect that any possible overloading of circuits might have on overcurrent protection
and power supply wiring. Appropriate consideration of equipment nameplate ratings should
be used when addressing this concern.
Reliable Ground
A reliable ground must be maintained at all times. To ensure this, the rack itself should be
grounded. Particular attention should be given to power supply connections other than the
direct connections to the branch circuit (i.e. the use of power strips, etc.).
To prevent bodily injury when mounting or servicing this unit in a rack, you must take
special precautions to ensure that the system remains stable. The following guidelines
are provided to ensure your safety:
This unit should be mounted at the bottom of the rack if it is the only unit in the rack.
When mounting this unit in a partially lled rack, load the rack from the bottom to the top
with the heaviest component at the bottom of the rack.
If the rack is provided with stabilizing devices, install the stabilizers before mounting or
servicing the unit in the rack.
Slide rail mounted equipment is not to be used as a shelf or a work space.
23
Chapter 2: Server Installation
2.4 Installing the Rails
There are a variety of rack units on the market, which may require a slightly di󰀨erent assembly
procedure. This rail set ts a rack between 26.8" and 36.4" deep.
The following is a basic guideline for installing the system into a rack with the rack mounting
hardware provided. You should also refer to the installation instructions that came with the
specic rack you are using.
Identifying the Rails
The chassis package includes two rail assemblies. Each assembly consists of three sections:
An inner rail that secures directly to the chassis, an outer rail that secures to the rack, and
a middle rail which extends from the outer rail. These assemblies are specically designed
for the left and right side of the chassis and labeled.
Figure 2-1. Identifying the Outer Rail, Middle Rail and Inner Rail
(Left Rail Assembly Shown)
Inner Rail
Locking Tab
Middle Rail
Outer Rail
24
Chapter 2: Server Installation
Figure 2-2. Extending and Releasing the Inner Rail
Releasing the Inner Rail
Each inner rail has a locking latch. This latch prevents the server from coming completely
out of the rack when when the chassis is pulled out for servicing.
To mount the rail onto the chassis, rst release the inner rail from the outer rails.
1. Pull the inner rail out of the outer rail until it is fully extended as illustrated below.
2. Press the locking tab down to release the inner rail.
3. Pull the inner rail all the way out.
Inner Rail
Locking Tab
Middle Rail
Outer Rail
1
2
3
25
Chapter 2: Server Installation
Figure 2-3. Installing the Inner Rails
Installing the Inner Rails on the Chassis
Installing the Inner Rails
1. Identify the left and right inner rails. They are labeled.
2. Place the inner rail rmly against the side of the chassis, aligning the hooks on the side
of the chassis with the holes in the inner rail.
3. Slide the inner rail forward toward the front of the chassis until the quick release bracket
snaps into place, securing the rail to the chassis.
4. Optionally, you can further secure the inner rail to the chassis with screws.
Figure 2-4. Inner Rails Installed on the Chassis
Inner Rails
4
3
2
4
26
Chapter 2: Server Installation
Figure 2-5. Extending and Mounting the Outer Rails
Installing the Outer Rails onto the Rack
Each end of the assembled outer rail includes a bracket with hooks and square, spring-loaded
pegs to t into the square holes in your rack.
Installing the Outer Rail
1. Press upward on the locking tab at the rear end of the middle rail.
2. Push the middle rail back into the outer rail.
3. Hang the hooks on the front of the outer rail onto the square holes on the front of the
rack. If desired, use screws to secure the outer rails to the rack.
4. Pull out the rear of the outer rail, adjusting the length until it just ts within the posts of
the rack.
5. Hang the hooks of the rear section of the outer rail onto the square holes on the rear of
the rack. Take care that the proper holes are used so the rails are level. If desired, use
screws to secure the rear of the outer rail to the rear of the rack.
Note: The gure above is for illustrative purposes only. Always install servers at the bottom
of the rack rst.
Stability hazard. The rack stabilizing mechanism must be in place, or the rack must be
bolted to the oor before you slide the unit out for servicing. Failure to stabilize the rack
can cause the rack to tip over.
1
4
3
2
Warning: Do not pick up the server with the front handles. They are designed to pull the
system from a rack only.
27
Chapter 2: Server Installation
2.5 Installing the Chassis into a Rack
Once rails are attached to the chassis and the rack, you can install the server.
Warning: Mounting the system into the rack requires at least two people to support the
chassis during installation. Please follow safety recommendations printed on the rails.
Installing the Chassis into a Rack
1. Extend the outer rails as illustrated.
2. Align the inner rails of the chassis with the outer rails on the rack.
3. Slide the inner rails into the outer rails, keeping the pressure even on both sides. When
the chassis has been pushed completely into the rack, it should click into the locked
position.
4. Optional screws may be used to hold the front of the chassis to the rack.
Figure 2-6. Installing the Server into the Rack
Note: Keep the ball bearing shuttle locked at the front of the middle rail during installation.
Note: Figure is for illustrative purposes only. Always install servers to the bottom of a rack rst.
4
Ball-Bearing Shuttle
1
2
2
29
Chapter 3: Maintenance and Component Installation
Chapter 3
Maintenance and Component Installation
This chapter provides instructions on installing and replacing main system components. To
prevent compatibility issues, only use components that match the specications and/or part
numbers given.
Installation or replacement of most components require that power rst be removed from the
system. Please follow the procedures given in each section.
3.1 Removing Power
Use the following procedure to ensure that power has been removed from the system. This
step is necessary when removing or installing non hot-swap components or when replacing
a non-redundant power supply.
1. Use the operating system to power down the system.
2. After the system has completely shut-down, disconnect the AC power cord(s) from the
power strip or outlet. (If your system has more than one power supply, remove the AC
power cords from all power supply modules.)
3. Disconnect the power cord(s) from the power supply module(s).
Note: This caution statement applies when changing any component or subsystem that is
not hot-swap/hot-plug.
30
Chapter 3: Maintenance and Component Installation
Figure 3-1. Removing the System Fan and Top Loading Drive Bay Cover
3.2 Accessing the System
Some maintenance will require accessing the inside of the server.
Removing the System Fan and Top Loading Drive Bay Cover
1. Power down the server as described in section 4-1 and remove the two screws from the
sides of the chassis cover.
2. Lift the cover o the chassis.
3. The four system fans and four 3.5" drive bays can be hot-swapped while system is
running. To prevent over temperature, limit access time to two minutes or less.
1
1
2
31
Chapter 3: Maintenance and Component Installation
Removing the Rear Top Chassis Cover
1. Remove the system fan and top loading drive bay cover as described in the above
section.
2. Remove the two screws from the sides of the chassis cover.
3. Slide the rear top cover toward the rear of the chassis.
4. Lift the rear top cover o the chassis.
Check that all ventilation openings on the top cover and the top of the chassis are clear and
unobstructed.
Caution: Except for short periods of time, do not operate the server without the cover in place.
The chassis cover must be in place to allow for proper airow and to prevent overheating.
Figure 3-2. Removing the Chassis Cover
2
2
43
32
Chapter 3: Maintenance and Component Installation
3.3 Processor and Heatsink Installation
The processor (CPU) and processor carrier should be assembled together rst to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed onto the CPU socket.
Notes:
Use ESD protection.
Unplug the AC power cord from all power supplies.
Check that the plastic protective cover is on the CPU socket and that none of the socket
pins are bent. If they are, contact your retailer.
When handling the processor, avoid touching or placing direct pressure on the land grid
array (gold contacts).
Improper installation or socket misalignment can cause serious damage to the processor
or the socket and may require manufacturer repairs.
Thermal grease is pre-applied on new heatsinks. No additional thermal grease is needed.
Refer to the Supermicro website for updates on processor support.
Graphics in this manual are for illustration only. Your components may look dierent.
33
Chapter 3: Maintenance and Component Installation
The Processor Carrier Assembly
The processor carrier assembly is comprised of the processor and the processor carrier.
1. Hold the processor with the land grid array (LGA, gold contacts) facing down. Locate the
gold triangle at the corner of the processor and the corresponding hollowed triangle on
the processor carrier as shown below. These triangles indicate the location of pin 1.
Latch
Latch
Processor (Reverse Side Up)
Carrier (Top Side Up)
CPU Key
CPU Key
Latch
Latch
Pin 1
Processor
Pin 1
Carrier
2. Turn the processor over (with the gold LGA up). Locate the CPU keys on the processor
and the four latches on the carrier as shown below.
34
Chapter 3: Maintenance and Component Installation
1
2A
B Latch
Latch
a
CPU Key (on the
processor)
CPU Key (on the
carrier)
CPU Key (on the
processor)
CPU Key (on
the carrier) b
5. Carefully place one end of the processor under latch 1 on the carrier, and then press the
other end down until it snaps into latch 2 and is properly seated on the carrier.
Processor Carrier Assembly
(Top View)
Processor Carrier Assembly
(Underside view)
3. Locate the lever on the carrier and, if necessary, press it down as shown below.
4. Align the CPU keys on the processor (A & B) with those on the carrier (a & b) as shown
below.
Lever
35
Chapter 3: Maintenance and Component Installation
Processor Carrier Assembly
Pin1
A
B
C
D
a
b
c
d
Heatsink
The Processor Heatsink Module (PHM)
After creating the processor carrier assembly, mount the heatsink onto the carrier assembly
to form the processor heatsink module (PHM).
Note: If this is a new heatsink, the thermal grease has been pre-applied. Otherwise, apply
the proper amount of thermal grease to the underside of the heatsink.
1. Turn the heatsink over with the thermal grease facing up. Note the two triangle cutouts
(A, B) located at the diagonal corners of the heatsink as shown in the drawing below.
2. On the processor carrier assembly, nd pin 1, as noted by the triangles. Hold the
processor carrier assembly over so that the gold LGA is facing up.
3. Align clip "a" (pin 1) on the carrier assembly with the triangular cutout A on the heatsink
and b, c, d on the carrier assembly with B, C, D on the heatsink.
4. Push the carrier assembly onto the heatsink, making sure that all four clips on each
corner are properly secured.
37
Chapter 3: Maintenance and Component Installation
d
a
b
c
A, B, C, D: Peek Nut
1, 2, 3, 4: Rotating Wire
a, b, c, d: Threaded Fastener
Peek Nut
(Unlatched) (latched)
Rotating Wire 3
Peek Nut
A
B
C
D
Rotating Wire 1
2
Rotating Wire
Rotating Wire 4
Threaded Fastener
Heatsink
CPU Socket
Peek Nut
Rotating Wire Side View
Top View
Unlatched State
a
b
c
d
(a, b, c, d: Threaded Fasteners) CPU Socket Pin1
Threaded FastenerCPU Socket
2. Locate four threaded fasteners (a, b, c, d) on the CPU socket.
3. Locate four PEEK nuts (A, B, C, D) and four rotating wires (1, 2, 3, 4) on the heatsink
as shown below.
4. Check that the rotating wires (1, 2, 3, 4) are in the unlatched position as shown.
38
Chapter 3: Maintenance and Component Installation
a, b, c, d:
Threaded Fastener on the CPU socket
A, B, C, D:
Peek Nut on the Heatsink
A
B
C
D
a
b
c
d
5. Align nut A (next to the triangles and pin 1) on the heatsink with threaded fastener "a"
on the CPU socket. Also align nuts B, C, D on the heatsink with threaded fasteners b, c,
d on the CPU socket.
6. Gently place the heatsink on the CPU socket, making sure that each nut is properly
aligned with its corresponding threaded fastener.
Latched State
Top View
7. Press all four rotating wires outward to latch the PHM onto the CPU socket.
C
D
A
B
8. With a t30-bit screwdriver, tighten all PEEK nuts in the sequence of A, B, C, and D with
even pressure not greater than 12 lbf-in.
Rotating Wire
39
Chapter 3: Maintenance and Component Installation
Peek Nut
Rotating Wire Side View
Unlatched State
Removing the PHM from the CPU Socket
Be sure the system is shut down and all AC power cords are unplugged.
1. Use a t30-bit screwdriver to loosen the four PEEK nuts on the heatsink in the sequence
of A, B, C, and D.
A
B
C
D
Peek Nut
2. Press the four rotating wires inward to unlatch the PHM as shown below.
3. Gently lift the PHM upward to remove it from the CPU socket.
40
Chapter 3: Maintenance and Component Installation
Removing the Processor Carrier Assembly from the PHM
Detach the four plastic clips (a, b, c, d) on the processor carrier assembly from the four corners
of the heatsink (A, B, C, D) as shown below, and lift o󰀨 the processor carrier assembly.
Pin1 Pin1
A
B
C
D
a
b
c
dProcessor Carrier Assembly
Heatsink
41
Chapter 3: Maintenance and Component Installation
Removing the Processor from the Carrier Assembly
Unlock the lever from its locked position and push it upwards to disengage the processor from
the carrier as shown below right. Carefully remove the processor from the carrier.
Processor Carrier Assembly Lever
Note: Handle the processor with care to avoid damage.
42
Chapter 3: Maintenance and Component Installation
3.4 Memory
Memory Support
The X12DPi-N(T)6 has 16 DIMM slots for up to 4TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/
RDIMM DDR4 ECC memory, plus 2 slots reserved for Intel Optane PMem 200 Series with
speeds of 3200MHz. Intel Optane PMem is supported by the 3rd Gen Intel Xeon Scalable
Platinum, Gold and selected Silver processors only. For validated memory, use our Product
Resources page.
DDR4 Memory Support for 3rd Gen Intel Xeon Scalable Processors
Type Ranks Per
DIMM and
Data Width
DIMM Capacity (GB) Speed (MT/s)
DRAM Density One DIMM
per Channel Two DIMMs
per Channel
8 Gb 16 Gb 1.2 Volts 1.2 Volts
RDIMM
SRx8 8GB 16GB
3200 3200
SRx4 16GB 32GB
DRx8 16GB 32GB
DRx4 32GB 64GB
RDIMM 3DS (4R/8R) x4 2H- 64GB
4H-128GB
2H-128GB
4H-256GB
LRDIMM QRx4 64GB 128GB
LRDIMM 3DS (4R/8R) x4 4H-128GB 2H-128GB
4H-256GB
Use the DIMM slots listed on the next page for memory modules. This memory population
table is based on guidelines provided by Intel to support Supermicro motherboards.
43
Chapter 3: Maintenance and Component Installation
Figure 3-3. Memory Slots
Note: Memory slots P1-DIMMB2 and P2-DIMMB2 are reserved for PMem 200 Series only.
Memory Population for the X12 DP Motherboard, 18 DIMM Slots
CPUs/DIMMs Memory Population Sequence
1 CPU & 1 DIMM A1
1 CPU & 2 DIMMs A1, E1
1 CPU & 4 DIMMs A1, C1, E1, G1
1 CPU & 6 DIMM A1, B1, C1, E1, F1, G1
1 CPU & 8 DIMMs A1, B1, C1, D1, E1, F1, G1, H1
1 CPU & 9 DIMMs A1, B1, C1, D1, E1, F1, G1, H1 and PMem in B2
2 CPUs & 2 DIMMs CPU1: A1
CPU2: A1
2 CPUs & 4 DIMMs CPU1: A1, E1
CPU2: A1, E1
2 CPUs & 6 DIMMs* CPU1: A1, C1, E1, G1
CPU2: A1, E1
2 CPUs & 8 DIMMs CPU1: A1, C1, E1, G1
CPU2: A1, C1, E1, G1
2 CPUs & 10 DIMMs* CPU1: A1, B1, C1. E1, F1, G1
CPU2: A1, C1, E1, G1
2 CPUs & 12 DIMMs CPU1: A1, B1, C1. E1, F1, G1
CPU2: A1, B1, C1. E1, F1, G1
2 CPUs & 14 DIMMs* CPU1: A1, B1, C1. D1, E1, F1, G1, H1
CPU2: A1, B1, C1. E1, F1, G1
2 CPUs & 16 DIMMs CPU1: A1, B1, C1. D1, E1, F1, G1, H1
CPU2: A1, B1, C1. D1, E1, F1, G1, H1
2 CPUs & 18 DIMMs CPU1: A1, B1, C1. D1, E1, F1, G1, H1 and Pmem in B2
CPU2: A1, B1, C1. D1, E1, F1, G1, H1 and Pmem in B2
*Unbalanced, not recommended.
44
Chapter 3: Maintenance and Component Installation
Optane PMem Population
Intel Optane PMem 200 Series, up to 18TB of PMem and 4TB DDR4.
Symmetric Population for Each CPU with PMem
DIMMs &
PMem Modes AD
Interleve
DIMM
F1 E1 H1 G1 C1 D1 A1 B2 B1
4 DIMM
4 PMem
AD
MM One - x4
PMem PMem PMem PMemDDR4 DDR4 DDR4 DDR4 -
DDR4 DDR4 DDR4 DDR4PMem PMem PMem PMem -
6 DIMM
1 PMem AD One - x1
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 -PMem
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
PMem DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4PMem -
8 DIMM
1 PMem AD DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4 DDR4One - x1 PMem
AD: App Direct, MM: Memory Mode
Validation Matrix (DDR4 DIMMs Validated with PMem 200 Series)
DIMM Type
(up to 3200)
Ranks Per DIMM
& Data Width
(Stack)
DIMM Capacity (GB)
DRAM Density
8Gb 16Gb
RDIMM
1Rx8 N/A N/A
1Rx4 16GB 32GB
2Rx8 16GB 32GB
2Rx4 32GB 64GB
RDIMM 3DS 4Rx4 (2H) N/A 128GB
8Rx4 (4H) NA 256GB
LRDIMM 4Rx4 64GB 128GB
LRDIMM 3DS 4Rx4 (2H) N/A N/A
8Rx4 (4H) 126GB 256GB
PMem Notes
Memory slots P1-DIMMB2 and P2-DIMMB2 are reserved for PMem 200 Series only.
Matrix targets congs for optimized PMem to DRAM cache ratio in MM and MM + AD
modes.
For each individual population, di󰀨erent PMem rearrangements among channels are per-
mitted so long as the conguration does not break X12 DP Memory population rules.
Ensure the same DDR4 DIMM type and capacity are used for each DDR4 + PMem popu-
lation.
If the system detects an unvalidated cong, then the system issues a BIOS warning. The
CLI functionality is limited in non-POR congurations, and select commands will not be
supported.
46
Chapter 3: Maintenance and Component Installation
Installing Memory
ESD Precautions
Electrostatic Discharge (ESD) can damage electronic com ponents including memory modules.
To avoid damaging DIMM modules, it is important to handle them carefully. The following
measures are generally su󰀩cient.
Use a grounded wrist strap designed to prevent static discharge.
Handle the memory module by its edges only.
Put the memory modules into the antistatic bags when not in use.
Installing Memory
Begin by removing power from the system as described in Section 3.1. Follow the memory
population sequence in the table above.
1. Push the release tabs outwards on both ends of the DIMM slot to unlock it.
Notches
Release Tabs
2. Align the key of the DIMM with the receptive point on the memory slot and with your
thumbs on both ends of the module, press it straight down into the slot until the module
snaps into place.
3. Press the release tabs to the locked position to secure the DIMM module into the slot.
Caution: Exercise extreme caution when installing or removing memory modules to prevent
damage to the DIMMs or slots.
Removing Memory
To remove a DIMM, unlock the release tabs then pull the DIMM from the memory slot.
Key
47
Chapter 3: Maintenance and Component Installation
Warning: There is a danger of explosion if the onboard battery is installed upside down (which
reverses its polarities). This battery must be replaced only with the same or an equivalent type
recommended by the manufacturer (CR2032).
Figure 3-4. Installing the Onboard Battery
3.5 Motherboard Battery
The motherboard uses non-volatile memory to retain system information when system power
is removed. This memory is powered by a lithium battery residing on the motherboard.
Replacing the Battery
Begin by from the system.removing power
1. Push aside the small clamp that covers the edge of the battery. When the battery is
released, lift it out of the holder.
2. To insert a new battery, slide one edge under the lip of the holder with the positive (+)
side facing up. Then push the other side down until the clamp snaps over it.
Note: Handle used batteries carefully. Do not damage the battery in any way; a damaged
battery may release hazardous materials into the environment. Do not discard a used battery
in the garbage or a public landll. Please comply with the regulations set up by your local
hazardous waste management agency to dispose of your used battery properly.
49
Chapter 3: Maintenance and Component Installation
Removing a Hot-Swap Drive Carrier
1. Push the release button located beside the drive's LEDs.
2. Swing the handle fully out.
3. Grasp the handle and use it to pull the drive carrier out of its bay.
Figure 3-6. Removing a Drive Carrier from the System
2
3
Mounting a Drive in a Drive Carrier
1. To add a new drive, install it into the carrier with the printed circuit board side facing
down so that the mounting holes align with those in the carrier.
2. Secure the drive to the carrier with the screws provided, then push the carrier
completely into the drive bay. You should hear a click when the drive is fully inserted.
This indicates that the carrier has been fully seated and connected to the midplane,
which automatically makes the power and logic connections to the hard drive.
50
Chapter 3: Maintenance and Component Installation
Removing a Drive from a Drive Carrier
1. Remove the screws that secure the hard drive to the carrier and separate the hard drive
from the carrier.
2. Replace the carrier back into the drive bay.
Hard Drive Carrier Indicators
Each hard drive carrier has two LED indicators: an activity indicator and a status indicator. In
RAID congurations, the status indicator lights to indicate the status of the drive. In non-RAID
congurations, the status indicator remains o󰀨.
Figure 3-8. Installing a Drive Carrier into its Bay
Figure 3-7. Mounting a Drive in a Carrier
51
Chapter 3: Maintenance and Component Installation
Internal 3.5" Hard Drives
The SC829U chassis supports four internal hot-swap 3.5" hard drives which are mounted
in individual hard drive trays contained in an internal chassis tray. After the chassis tray has
been installed into the chassis, the power can stay on when removing or installing the hard
drives from their individual trays.
Setting up the Internal Chassis Tray and Individual Trays
1. Power down the system and remove the chassis covers as described in Section 3.2.
2. Remove the two side screws securing the tray to the chassis and set them aside for
later use.
3. Lift the hard chassis tray up and out of the chassis.
Figure 3-9. Removing the Chassis Tray
Figure 3-10. Removing Screws from the Individual Trays
4. Remove the screws securing each hard drive tray to the chassis tray.
2
3
4
52
Chapter 3: Maintenance and Component Installation
Figure 3-11. Removing a Hard Drive Carrier from the Hard Drive Tray
Figure 3-12. Installing a Hard Drive into its Tray
5. Lift the individual trays up and out of the chassis tray.
6. Place a hard drive into each of the individual trays and secure it with four screws.
7. Place the hard drives and individual trays into the chassis tray.
5
53
Chapter 3: Maintenance and Component Installation
8. Secure the individual trays into the chassis tray with four screws.
Figure 3-13. Installing Hard Drives and Carriers into the Hard Drive Tray
Figure 3-14. Installing the Hard Drive Tray into the Chassis
9. Place the loaded chassis tray into the chassis.
10. Secure the chassis tray with the two side screws previously set aside.
11. Plug the power cords into the rear of the power supply, replace the top cover and power
up the system.
8
10
10
9
55
Chapter 3: Maintenance and Component Installation
3.7 System Cooling
Four 8-cm heavy duty fans provide the cooling for the system. Fan speed is controlled by
system temperature using the BMC. If a fan fails, the remaining fans will ramp up to full speed
and the system will continue to operate. Replace any failed fan at your earliest convenience
with the same type and model.
Make sure the chassis top cover makes a good seal for proper air circulation.
Figure 3-15. Fan Positions
1
3
2
4
56
Chapter 3: Maintenance and Component Installation
Perforated Tabs
Figure 3-16. Installing the Air Shroud
Installing the Air Shroud
Air shrouds concentrate airow to maximize fan e󰀩ciency. They do not require screws to
install.
Installing the Standard Air Shroud
Position the air shroud as illustrated in the gure below, sliding the front over the edge of
the fan tray. Align the holes in the edge of the shroud with the hold in the fan tray.
Shroud
Perforated Tabs
58
Chapter 3: Maintenance and Component Installation
Figure 3-17. Replacing the Power Supply
Release Tab
59
Chapter 3: Maintenance and Component Installation
3.9 PCI Expansion Cards
The system accepts up to six PCIe expansion cards.
Figure 3-18. Expansion Slots
Installing an Expansion Card
1. Power down the system as described in section 3.1 and remove the cover.
2. Unscrew and remove the chassis slot cover.
3. Insert the expansion card into a slot on the motherboard while aligning the expansion
card backplate with the open slot in the rear of the chassis. Secure with a screw.
4. Replace the cover and power.
124 3
65
Expansion Card Chassis Slots
Item Description
1PCIe 4.0x8 low-prole slot (Occupied by 3916 SAS 620P-ACR16H controller or 3816 SAS
620P-ACR16L controller)
23PCIe 4.0x16 low-prole slot
45PCIe 4.0x16 low-prole slot
6PCIe 4.0x8 low-prole slot
60
Chapter 3: Maintenance and Component Installation
Default SATA Cable
Figure 3-19. Cable Routing Diagram
3.10 Cable Routing Diagram
Refer to this section when routing or rerouting cables. Proper routing is important to maintain
airow through the system.
Cable part numbers and descriptions are available at the Online Cable Matrix.
Backplane Power Cable
Front Panel Control Cable
SAS Cable
Optional NVMe Cable
Backplane1
BPN-SAS3-LA26-N12
Manual
Backplane2
BPN-SAS3-829HA-A4
61
Chapter 4: Motherboard Connections
Chapter 4
Motherboard Connections
This section describes the jumpers, connections and LEDs on the motherboard and provides
pinout denitions. Some connections might not be used in this system. A motherboard layout
indicating component locations may be found in . More detail can be found in the Chapter 1
Motherboard Manual.
4.1 Input/Output Ports
Figure 4-1. Rear I/O Ports
LAN Ports
There is a dedicated BMC LAN port (4) and two 10G BASE-T ports (7 and 8).
Unit Identier Switch/UID LED Indicator
A Unit Identier (UID) switch (10) and a UID LED indicator are located on the rear of the
system. When you press the UID switch, both front and rear UID LED indicators are toggled
on or o. The UID indicators provide easy identication of a system in a rack. The UID can
also be triggered using the BMC.
Note: The UID switch can also be used to reset the BMC. See details.
4
25
3
987
6
1
10
Rear I/O Ports
# #Description Description
1 6COM Port 1 USB3 (3.0)
2 7USB7 (3.0) LAN1
3 8USB8 (3.0) LAN2
4 9Dedicated BMC LAN (Rear) VGA Port
5 USB2 (3.0) UID/BMC Reset Switch10
62
Chapter 4: Motherboard Connections
4.2 Power Connections
Two power connections supply the motherboard and several more supply for onboard devices.
Main Power Connector
The 24-pin power supply connector (JPWR3) meets the ATX SSI EPS 12V specication. You
must also connect the 8-pin (JPWR1) and 4-pin (JPWR2) processor power connector to the
power supply.
Important: To provide adequate power to the motherboard, connect both the main power
connector and 8-pin/4-pin power connectors to the power supply. Failure to do so may void
the manufacturer's warranty on your power supply and motherboard.
8-pin Power
Pin Denitions
Pin# Denition
1 - 4 Ground
5 - 8 +12 Vdc
4-pin Power
Pin Denitions
Pin# Denition
1 - 2 Ground
3 - 4 +12Vdc
4.3 Headers and Connectors
Fan Headers
There are seven fan headers (FAN1-FAN5, FANA, FANB) on the motherboard. These are
4-pin fan headers, although pins 1-3 are backward compatible with traditional 3-pin fans.
Four-pin fans allow fan speeds to be controlled by Thermal Management in the BMC. When
using the Thermal Management setting, use all 3-pin fans or all 4-pin fans.
Fan Header
Pin Denitions
Pin# Denition
1 Ground (Black)
2 +12V (Red)
3 Tachometer
4 PWM Control
SGPIO Header
A Serial General Purpose Input/Output header (S-SGPIO1) is used to communicate with the
enclosure management chip on the backplane.
SGPIO Header
Pin Denitions
Pin# Pin#Denition Denition
1 2NC NC
3 4Ground DATA Out
5 6Load Ground
7 8Clock NC
NC = No Connection
63
Chapter 4: Motherboard Connections
TPM Header
The JTPM1 header is used to connect a Trusted Platform Module (TPM)/Port 80, which
is available from Supermicro. A TPM/Port 80 connector is a security device that supports
encryption and authentication in hard drives. It allows the motherboard to deny access if the
TPM associated with the storage drive is not installed in the system. For more information
on the TPM: www.supermicro.com/manuals/other/TPM.pdf.
Trusted Platform Module/Port 80 Header
Pin Denitions
Pin# Pin#Denition Denition
1 2P3V3 SPI_TPM_CS_N
3 4PCI-E_RESET_N# SPI_PCH_MISO
5 6SPI_PCH_CLK# Ground
7 8SPI_PCH_MOSI N/A
9 JTPM1_P3V3A 10 IRQ_TPM_SPIN_N
Disk-On-Module Power Connector
Two power connectors for SATA DOM (Disk-On-Module) devices are located at JSD1 and
JSD2. Connect appropriate cables here to provide power support for your Serial Link DOM
devices.
DOM Power
Pin Denitions
Pin# Denition
1 5V
2 Ground
3 Ground
Standby Power
The 5V Standby Power header is located at JSTBY1. You must have a card with a Standby
Power connector and a cable to use this feature.
Standby Power
Pin Denitions
Pin# Denition
1 +5V Standby
2 Ground
3 No Connection
64
Chapter 4: Motherboard Connections
Power SMB (I2C) Header
The Power System Management Bus (I 2C) connector (JPI 2C1) monitors the power supply,
fan, and system temperatures.
Power SMB Header
Pin Denitions
Pin# Denition
1 Clock
2 Data
3 PMBUS_Alert
4 Ground
5 +3.3V
BMC External I2C Header
A System Management Bus header for IPMI 2.0 is located at JIPMB1. Connect the appropriate
cable here to use the IPMB I 2C connection on your system.
External I2C Header
Pin Denitions
Pin# Denition
1 Data
2 Ground
3 Clock
4 3V3_STBY
NVMe I2C Header
Connector JNVI 2C1 is a management header for the Supermicro AOC NVMe PCIe peripheral
cards. Please connect the I 2C cable to this connector.
Chassis Intrusion
A Chassis Intrusion header is located at JL1. Attach the appropriate cable from the chassis
to the header to alert when the chassis is opened.
Chassis Intrusion
Pin Denitions
Pins Denition
1 Intrusion Input
2 Ground
66
Chapter 4: Motherboard Connections
SATA Ports
Eight SATA 3.0 ports are supported by the chipset. These SATA ports support RAID 0, 1, 5,
and 10. In addition, there are also two S-SATA ports (S-SATA0, S-SATA1) that include SATA
DOM power.
For more information on the SATA HostRAID conguration, refer to the Intel SATA HostRAID
user's guide posted at http://www.supermicro.com.
NVM Express Header
One connector is located at NVME0/1 to support two PCIe 4.0 p66-x4 NVMe connections. This
connector provides high-speed and low-latency connections directly from the CPU to NVMe
Solid State (SSD) drives.
Figure 4-3. JF1 Control Panel Pins
Control Panel
JF1 contains header pins for various control panel connections. See the gure below for the
pin locations and denitions of the control panel buttons and LED indicators.
All JF1 wires have been bundled into a single cable to simplify this connection. Make sure
the red wire plugs into pin 1 as marked on the motherboard. The other end connects to the
control panel PCB board.
NMI (Control signal)
Key
(3.3V standby)
UID_SW
(3.3V standby)
(3.3V standby)
UID LED
(3.3V)
Reset Button (Data signal)
Power Button (Data signal)
(Ground)
Key
Power On LED
HDD LED)
NIC1 LED
NIC2 LED
OH/Fan Fail LED
Power Fail LED
(Ground)
(Ground)
2 1
20 19
Power Button
The Power Button connection is located on pins 1 and 2 of JF1. Momentarily contacting both
pins will power on/o󰀨 the system. This button can also be congured to function as a suspend
button (with a setting in the BIOS - see Chapter 6). To turn o󰀨 the power when the system
is in suspend mode, press the button for 4 seconds or longer.
Power Button
Pin Denitions (JF1)
Pin# Denition
1 Signal
2 Ground
67
Chapter 4: Motherboard Connections
Reset Button
The Reset Button connection is located on pins 3 and 4 of JF1. Attach it to a hardware reset
switch on the computer case.
Reset Button
Pin Denitions (JF1)
Pin# Denition
3 Reset
4 Ground
Power Fail LED
The Power Fail LED connection is located on pins 5 and 6 of JF1.
Power Fail LED
Pin Denitions (JF1)
Pin# Denition
5 3.3V
6 PWR Supply Fail
OH/Fan Fail Indicator
Status
Status Denition
O Normal
On Overheat
Flashing Fan Fail
Overheat (OH)/Fan Fail
Connect an LED cable to pins 7 and 8 of JF1 to use the Overheat/Fan Fail LED connections.
The LED on pin 8 provides warnings of overheat or fan failure.
OH/Fan Fail LED
Pin Denitions (JF1)
Pin# Denition
7 Blue LED
8 OH/Fan Fail LED
NIC1/NIC2 (LAN1/LAN2)
The NIC (Network Interface Controller) LED connection for LAN port 1 is located on pins 11
and 12 of JF1, and the LED connection for LAN port 2 is on pins 9 and 10. Attach the NIC
LED cables here to display network activity.
LAN1/LAN2 LED
Pin Denitions (JF1)
Pin# Denition
9 NIC2 Activity LED
10 NIC2 Link LED
11 NIC1 Activity LED
12 NIC1 Link LED
68
Chapter 4: Motherboard Connections
HDD LED/UID Switch
The HDD LED/UID Switch connection is located on pins 13 and 14 of JF1. Attach a cable to
Pin 14 to show hard drive activity status. Attach a cable to pin 13 to use UID switch.
HDD LED
Pin Denitions (JF1)
Pin# Denition
13 3.3V Standby/UID Switch
14 HDD Active
Power LED
The Power LED connection is located on pins 15 and 16 of JF1.
Power LED
Pin Denitions (JF1)
Pin# Denition
15 3.3V
16 Power LED
NMI Button
The non-maskable interrupt button header is located on pins 19 and 20 of JF1.
NMI Button
Pin Denitions (JF1)
Pin# Denition
19 Control
20 Ground
69
Chapter 4: Motherboard Connections
4.4 Jumpers
Explanation of Jumpers
To modify the operation of the motherboard, jumpers are used to choose between optional
settings. Jumpers create shorts between two pins to change the function associated with it.
Pin 1 is identied with a square solder pad on the printed circuit board. See the motherboard
layout page for jumper locations.
Note: On a two-pin jumper, "Closed" means the jumper is on both pins and "Open" indicates
the jumper is either on only one pin or has been completely removed.
Connector
Pins
Jumper
Setting
3 2 1
3 2 1
ME Manufacturing
ME Recovery (JPME1) is used to enable or disable the ME Recovery feature of the
motherboard. The jumper will reset Intel ME values back to their default settings.
Manufacturing Mode
Jumper Settings
Jumper Setting Denition
Pins 1-2 Normal
Pins 2-3 Manufacturing Mode
70
Chapter 4: Motherboard Connections
Unit ID LED
A rear unit identier (UID) indicator at LE6 is located near the UID switch on the I/O back
panel. It provides easy identication of a unit that may need service.
M.2 Heartbeat LED
When LE4 is blinking, the M.2 slot is functioning normally.
Onboard Power LED
LDPWR3 is the onboard power indicator. When this LED is on, the system power is connected.
BMC Heartbeat LED
LEDBMC is the BMC heartbeat indicator. When the LED is blinking green, BMC is functioning
normally.
4.5 LED Indicators
Network LAN LEDs
The Ethernet ports each have two LEDs. One LED indicates activity when ashing green.
The other may be green, amber or o to indicate the speed of the connection.
LAN Link LED
Color Denition
O No Connection or 100Mb/s
Green 10Gb/s
Amber 1Gb/s
Dedicated BMC LAN LEDs
A dedicated BMC LAN port provides a connection to the BMC. The Link LED indicates the
speed of the connection. The other LED indicates activity.
BMC Link LED
Color Denition
O No Connection
Green 100 Mb/s
Amber 1 Gb/s
Link LED
(speed) Activity LED
71
Chapter 5: Software
Chapter 5
Software
After the hardware has been installed, you can install the Operating System (OS), congure
RAID settings and install the drivers.
5.1 Microsoft Windows OS Installation
If you will be using RAID, you must congure RAID settings before installing the Windows
OS and the RAID driver. Refer to the RAID Conguration User Guides posted on our website
at www.supermicro.com/support/manuals.
Installing the OS
1. Create a method to access the MS Windows installation ISO le. That might be a DVD,
perhaps using an external USB/SATA DVD drive, or a USB ash drive, or the BMC KVM
console.
2. Boot from a bootable device with Windows OS installation. You can see a bootable
device list by pressing during the system startup.F11
Figure 5-1. Select Boot Device
72
Chapter 5: Software
3. During Windows Setup, continue to the dialog where you select the drives on which to
install Windows. If the disk you want to use is not listed, click on “Load driver” link at the
bottom left corner.
Figure 5-2. Load Driver Link
To load the driver, browse the USB ash drive for the proper driver les.
For RAID, choose the SATA/sSATA RAID driver indicated then choose the storage drive
on which you want to install it.
For non-RAID, choose the SATA/sSATA AHCI driver indicated then choose the storage
drive on which you want to install it.
4. Once all devices are specied, continue with the installation.
5. After the Windows OS installation has completed, the system will automatically reboot
multiple times.
73
Chapter 5: Software
5.2 Driver Installation
The Supermicro website contains drivers and utilities for your system at
https:// www. supermicro. com/wdl/driver. Some of these must be installed, such as the
chipset driver.
After accessing the website, go into the CDR_Images (in the parent directory of the above
link) and locate the ISO le for your motherboard. Download this le to to a USB ash drive
or a DVD. (You may also use a utility to extract the ISO le if preferred.)
Another option is to go to the Supermicro website at www.supermicro.com > Products. Find
the product page for your motherboard, and "Download the Latest Drivers and Utilities".
Insert the ash drive or disk and the screenshot shown below should appear.
Figure 5-3. Driver and Tool Installation Screen
Note: Click the icons showing a hand writing on paper to view the readme les for each
item. Click the computer icons to the right of these items to install each item (from top to the
bottom) one at a time. After installing each item, you must re-boot the system before
moving on to the next item on the list. The bottom icon with a CD on it allows you to view
the entire contents.
74
Chapter 5: Software
5.3 SuperDoctor ® 5
The Supermicro SuperDoctor 5 is a program that functions in a command-line or web-based
interface for Windows and Linux operating systems. The program monitors such system health
information as CPU temperature, system voltages, system power consumption, fan speed,
and provides alerts via email or Simple Network Management Protocol (SNMP).
SuperDoctor 5 comes in local and remote management versions and can be used with Nagios
to maximize your system monitoring needs. With SuperDoctor 5 Management Server (SSM
Server), you can remotely control power on/oand reset chassis intrusion for multiple systems
with SuperDoctor 5 or BMC. SuperDoctor 5 Management Server monitors HTTP, FTP, and
SMTP services to optimize the eciency of your operation.
SuperDoctor ® Manual and Resources
Figure 5-4. SuperDoctor 5 Interface Display Screen (Health Information)
75
Chapter 5: Software
5.4 BMC
The motherboard provides remote access, monitoring and management through the
baseboard management controller (BMC) and other management controllers distributed
among dierent system modules. There are several BIOS settings that are related to BMC.
For general documentation and information on BMC, visit our website at:
www.supermicro.com/en/solutions/management-software/bmc-resources
BMC ADMIN User Password
For security, each system is assigned a unique default BMC password for the ADMIN user.
This can be found on a sticker on the chassis and a sticker on the motherboard. The sticker
also displays the BMC MAC address.
Figure 5-5. BMC Password Label
See Chapter 1 for the of the labels.location
76
Chapter 6: Optional Components
Chapter 6
Optional Components
This chapter describes optional system components and installation procedures.
Optional Parts
Rear 2.5" Storage Drives
Storage Control Card and Cable(s)
TPM security module
Intel VROC RAID Key
6.1 Additional Storage Drives
The system supports two hot-swap 2.5" SATA or NVMe drives, accessible from the chassis
rear.
6.2 Storage Control Card and Cable(s)
Supermicro o󰀨ers storage controller cards for various data protection and drive RAID levels.
Please refer to the product page for the latest cards and add-on options.
77
Chapter 6: Optional Components
6.3 TPM Security Module
SPI capable TPM 2.0 (or 1.2) with Inneon 9670 controller, horizontal form factor
The JTPM1 header is used to connect a Trusted Platform Module (TPM). A TPM is a security
device that supports encryption and authentication in hard drives. It enables the motherboard
to deny access if the TPM associated with the hard drive is not installed in the system.
Details and installation procedures are at:
http://www.supermicro.com/manuals/other/TPM.pdf.
AOM-TPM-9670V
AOM-TPM-9671V
78
Chapter 6: Optional Components
6.4 Intel Virtual RAID on CPU (VROC)
Intel® Virtual RAID on CPU (Intel VROC) is an enterprise RAID solution for NVMe SSDs
directly attached to Intel Xeon Scalable processors. Intel Volume Management Device (VMD)
is an integrated controller inside the CPU PCI-E root complex.
A single processor supports up to 12 NVMe SSDs and up to 6 RAID arrays.
A dual processor system supports up to 24 NVMe SSDs and 12 RAID arrays.
Stripe sizes are 4K, 8K, 16K, 32K, 64K, 128K.
Requirements and Restrictions
Intel VROC is only available when the system is congured for UEFI boot mode.
To enable the command and support for RSTe, install the patch frommdadm
Linux: https://downloadcenter.intel.com/download/28158/Intel-Virtual-RAID-on-CPU-In-
tel-VROC-and-Intel-Rapid-Storage-Technology-enterprise-Intel-RSTe-Driver-for-Linux-
Windows: https://downloadcenter.intel.com/download/28108/Intel-Virtual-RAID-on-
CPU-Intel-VROC-and-Intel-Rapid-Storage-Technology-enterprise-Intel-RSTe-Driver-for-
Windows-
To enable Intel VROC, a hardware key must be inserted on the motherboard, and the ap-
propriate processor’s Virtual Management Devices must be enabled in the BIOS setup.
It is possible to enable Intel VROC without a hardware key installed, but only RAID0 will
be enabled.
Intel VROC is not compatible with secure boot. This feature must be disabled.
When creating bootable OS RAID1 devices, you must have both devices on the same
CPU, and a VMD on that CPU.
Spanning drives when creating RAID devices is not recommended to due to performance
issues, even though it is supported.
Supported SSDs and Operating Sytems
To see the latest support information: https://www.intel.com/content/www/us/en/support/
articles/000030310/memory-and-storage/ssd-software.html

Produktspecifikationer

Varumärke: Supermicro
Kategori: Inte kategoriserad
Modell: SuperServer SSG-620P-ACR16H

Behöver du hjälp?

Om du behöver hjälp med Supermicro SuperServer SSG-620P-ACR16H ställ en fråga nedan och andra användare kommer att svara dig




Inte kategoriserad Supermicro Manualer

Inte kategoriserad Manualer

Nyaste Inte kategoriserad Manualer