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USER'S MANUAL
Revision 1.0b
X12DDW-A6
The information in this user’s manual has been carefully reviewed and is believed to be accurate. The manufacturer
assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment
to update or to keep current the information in this manual, or to notify any person or organization of the updates.
Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in an industrial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See ”.www.dtsc.ca.gov/hazardouswaste/perchlorate
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0b
Release Date: October 04, 2022
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2022 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
3
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X12DDW-A6 motherboard.
About This Motherboard
The Supermicro X12DDW-A6 supports dual 3rd Gen Intel® Xeon® Scalable Processors (in
Socket P+ LGA 4189) with up to 40 CPU cores and a thermal design power (TDP) of up to
270W. Built with the Intel C621A chipset, the X12DDW-A6 supports up to 4TB 3DS LRDIMM/
LRDIMM/3DS RDIMM/RDIMM DDR4 ECC memory with speeds of 3200/2933/2666MHz in 16
DIMMs and up to 4TB Intel® Optane™ PMem 200 Series with speeds of up to 3200MHz.
(See the notes below). This motherboard features superior IO expandability, which includes
four PCIe 4.0 x16 slots, 12 PCIe 4.0 p3-x4 NVMe ports, 14 SATA 3.0 ports, four USB ports,
and exible AIOM option for Ethernet connections. It also offers the most advanced data
protection capability that encompasses TPM (Trusted Platform Module) and RoT (Root of
Trust) support. The X12DDW-A6 is optimized for high-performance, high-end computing
platforms and is ideal for general purpose, data center, and enterprise applications. Please
note that this motherboard is intended to be installed and serviced by professional technicians
only. For processor/memory updates, please refer to our website at http://www.supermicro.
com/products/.
No t e 1: I n t e l ® O p t a ne ™ P M e m 2 0 0 S er i e s i s s u pp o r t e d b y t h e
3rd Gen Intel Xeon Scalable Processors (83xx/63xx/53xx/4314 Series only.)
Note 2: Memory speed support depends on the processors used in the system.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates high voltage may be encountered while performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Important: Important information given to ensure proper system installation or to
relay safety precautions.
Note: Additional Information given to differentiate various models or to provide in-
formation for proper system setup.
4
Super X12DDW-A6 User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: Marketing@supermicro.com (General Information)
Sales-USA@supermicro.com (Sales Inquiry: Non-Government)
Government_Sales-USA@supermicro.com (Sales Inquiry:
Government)
Support@supermicro.com (Technical Support)
RMA@supermicro.com (RMA Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: Sales_Europe@supermicro.com (General Information)
Support_Europe@supermicro.com (Technical Support)
RMA_Europe@supermicro.com (RMA Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: Sales-Asia@supermicro.com.tw (Sales Inquiry)
Support@supermicro.com.tw (Technical Support)
RMA@supermicro.com.tw (RMA Support)
Website: www.supermicro.com.tw
5
Table of Contents
Chapter 1 Introduction
1.1 Checklist ...............................................................................................................................7
1.2 Processor and Chipset Support .........................................................................................17
1.3 Special Features ................................................................................................................18
1.4 System Health Monitoring ..................................................................................................18
1.5 ACPI Features ....................................................................................................................19
1.6 Power Supply ......................................................................................................................19
1.7 Serial Port ...........................................................................................................................19
1.8 Intel® Optane™ Persistent Memory (PMem) 200 Series Overview ..................................20
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................21
2.2 Processor and Heatsink Installation ...................................................................................22
The 3rd Gen Intel Xeon Scalable Processor ....................................................................22
Overview of the CPU Socket ............................................................................................26
Overview of the Processor Carrier Assembly ...................................................................27
Overview of the Processor Heatsink Module ....................................................................28
Creating the Processor Carrier Assembly .........................................................................29
Creating the Processor Heatsink Module (PHM) ..............................................................31
Preparing the CPU Socket for Installation ........................................................................32
Preparing to Install the Processor Heatsink Module (PHM) into the CPU Socket ...........33
Installing the Processor Heatsink Module (PHM) ............................................................34
Removing the Processor Heatsink Module from the CPU Socket ...................................35
Removing the Processor Carrier Assembly from the Processor Heatsink Module (PHM) ...
..........................................................................................................................................36
Removing the Processor from the Processor Carrier Assembly ......................................37
2.3 Motherboard Installation .....................................................................................................38
2.4 Memory Support and Installation .......................................................................................40
2.5 Rear I/O Ports ....................................................................................................................44
2.6 Front Control Panel ............................................................................................................49
2.7 Connectors .........................................................................................................................54
2.8 Jumper Settings .................................................................................................................67
2.9 LED Indicators ....................................................................................................................69
Preface
6
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................72
3.2 Technical Support Procedures ...........................................................................................75
3.3 Frequently Asked Questions ..............................................................................................76
3.4 Battery Removal and Installation .......................................................................................77
3.5 Returning Merchandise for Service ....................................................................................78
Chapter 4 UEFI BIOS
4.1 Introduction .........................................................................................................................79
4.2 Main Setup .........................................................................................................................80
4.3 Advanced Setup Congurations .........................................................................................82
4.4 Event Logs .......................................................................................................................142
4.5 BMC ..................................................................................................................................144
4.6 Security .............................................................................................................................147
4.7 Boot ..................................................................................................................................152
4.8 Save & Exit .......................................................................................................................155
Appendix A BIOS POST Codes
BIOS POST Codes ..................................................................................................................157
Appendix B Software
B.1 Microsoft Windows OS Installation ...................................................................................158
B.2 Driver Installation ..............................................................................................................160
B.3 SuperDoctor® 5 .................................................................................................................161
B.4 BMC ..................................................................................................................................162
B.5 Logging into the BMC (Baseboard Management Controller) ...........................................162
Appendix C Standardized Warning Statements
Super X12DDW-A6 User's Manual
8
Super X12DDW-A6 User's Manual
X12DDW-A6 Motherboard Image
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
9
Chapter 1: Introduction
X12DDW-A6 Motherboard Layout
(not drawn to scale)
Note: Components not documented are for internal testing only.
BAR CODE
MAC CODE
X12DDW-A6
REV:1.01
JS2
JNVME8 JNVME7
JNVME6 JNVME5JNVME4 JNVME3JNVME2 JNVME1
S-UM16
S-UM14
S-UM15
S-UM13
J35
JLUIO1
JRUIO1
JAIOM1 JAIOM2
MH10
MH11
S-S A5AT
S-S A4AT
JM2_2JM2_1
JFP2
JLUIO2 JRUIO2
61HM51HM
JCOM1
JFP1
JS1
JPCIE1 JPCIE4
JPCIE3JPCIE2
JSTBY1
JBT1
S-SGPIO2
JTPM1
JUSBRJ45
JVGA1
JUIDB1
JPWR1
LE4
LE7
LE3
LE6
JPI2C1
BT1
FAN6
FAN5
FAN4
FAN3
FAN2
FAN1
JL1
JRK1
JF1
JIPMB1
JPWR3JPWR2
BMC
BMC Firmware
BIOS
Battery
Power LED
USB0/1 (2.0)
P2_PCIE0 P2_PCIE1
P1_PCIE1 P1_PCIE0
P2_NVME2
P2_NVME3
P2_NVME0P2_NVME1
P1_NVME2P1_NVME3P1_NVME1 P1_NVME0
P2_AIOMP1_AIOM M.2-P1
P1-DIMME1
P1-DIMMF1
P1-DIMMH1
P1-DIMMG1
UID
CPU1
CPU1 LUIO2 PCIe 4.0 X16
P1-DIMMC1
P1-DIMMD1
P1-DIMMA1
P1-DIMMB1
COM1
VROC
TPM/PORT80
USB2/3(3.0)
I-S A0~7 S-S A0~3AT AT
S-S A4 S-S A1AT AT
BMC_LAN
VGA
P2-DIMMF1
P2-DIMME1
P2-DIMMH1
P2-DIMMG1
CPU2 RUIO2 PCI-E 4.0 X16
M.2-P2
CPU2
P2-DIMMD1
P2-DIMMC1
P2-DIMMA1
P2-DIMMB1
PCH
CPLD
JNCSI1
LEDM1
JRU1
LEDPWR
11
Chapter 1: Introduction
Quick Reference Table
Jumper Description Default Setting
JBT1 Clear CMOS Open (Normal)
JRU1 Front Control Board (JFP1) Signal Reset Jumper Pins 1-2 (Reset JFP1 Signals for Power Button Use)
LED Description Status
LE3 Power LED LED On: Onboard Power On
LE4 M.2-P1 Heartbeat LED Blinking Green: M.2 device normal
LE6 Unit Identier (UID) LED Solid Blue: Unit Identied
LE7 M.2-P2 Heartbeat LED Blinking Green: M.2 device normal
LEDM1 BMC Heartbeat LED Blinking Green: BMC Normal
Connector Description
Battery (BT1) Onboard CMOS battery
COM1 (JCOM1) Rear I/O COM port
CPU1 LUIO2 (JLUIO2) Left side PCIe 4.0 x16 riser card slot supported by CPU1
CPU2 RUIO2 (JRUIO2) Right side PCIe 4.0 x16 riser card slot supported by CPU2
FAN1 - FAN6 CPU/System fan headers
BMC_LAN (JUSBRJ45) Dedicated BMC LAN port
JF1 Front Control Panel header
JFP1 Front Control Board header for signals (can be used independently)
JFP2 Front Control Board header for VGA & USB (to be used in conjunction with JFP1)
JIPMB1 4-pin BMC external I2C header
JL1 Chassis Intrusion header
JNCSI1 NC-SI (Network Controller Sideband Interface) connector (See the note below.)
JPI2C1 Power System Management Bus (SMB) I2C header
JPWR1/JPWR2 8-pin power connectors
JPWR3 24-pin ATX power connector
JLUIO1 Power connector used for left side PCIe 4.0 x16 riser card (CPU1 LUIO2)
JRUIO1 Power connector used for right side PCIe 4.0 x16 riser card (CPU2 RUIO2)
JSTBY1 5V Standby power header
JTPM1 Trusted Platform Module/Port 80 connector
M.2-P1 (JM2_1) PCIe 3.0 p11-x2 M.2 slot from PCH (support for M-Key 2280)
M.2-P2 (JM2_2) PCIe 3.0 p11-x2 M.2 slot from PCH (support for M-Key 2280)
MH10/MH11 M.2-P1 module mounting hole (MH10)/M.2-P2 module mounting hole (MH11)
MH15/MH16 CPU1 LUIO2 PCIe slot guide pin (MH15)/CPU2 RUIO2 PCIe slot guide pin (MH16)
P1_AIOM (JAIOM1) AIOM (Advanced I/O Module) PCIe 4.0 x16 supported by CPU1
P2_AIOM (JAIOM2) AIOM (Advanced I/O Module) PCIe 4.0 x16 supported by CPU2
Note: For detailed instructions on how to congure Network Interface Card (NIC) set-
tings, please refer to the Network Interface Card Conguration User's Guide posted on
the web page under the link: http://www.supermicro.com/support/manuals/.
13
Chapter 1: Introduction
Motherboard Features
CPU
• Supports two 3rd Gen Intel Xeon Scalable Processors (in Socket P+ LGA 4189) with up to 40 cores and a thermal design
power (TDP) of up to 270W
Memory
• Supports up to 4TB 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of
3200/2933/2666MHz in 16 memory slots and up to 4TB Intel Optane PMem 200 Series with speeds of up to 3200MHz
Note 1: Intel Optane PMem 200 Series is supported by the 3rd Gen Intel Xeon Scalable Processors
(83xx/63xx/53xx/4314 only.) Series
Note 2: Memory speed and capacity support depends on the processors used in the system.
DIMM Size
• Up to 256GB at 1.2V
Note: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/
motherboard.
Chipset
• Intel PCH C621A
Expansion Slots
• One left side PCIe 4.0 x16 riser card slot supported by CPU1 (CPU1 LUIO2) and one right side PCIe 4.0 x16 riser card
slot supported by CPU2 (CPU2 RUIO2)
• Two AIOM (Advanced I/O Module) PCIe 4.0 x16 slots supported by CPU1 & CPU2 (P1_AIOM/P2_AIOM)
• Four PCIe 4.0 x16 slots supported by CPU1/2 (P1_PCIE0/1 & P2_PCIE0/1)
• Two PCIe 3.0 p13-x2 M.2 slots (with M-Key 2280 support) from PCH
• Four PCIe 4.0 p13-x4 SlimSAS ports w/support of four NVME connections each port supported by CPU 1(P1-NVME0/1, P1-
NVME2/3)
• Four PCIe 4.0 p13-x4 SlimSAS ports w/support of four NVME connections each port supported by CPU2 (P2-NVME0/1, P2-
NVME2/3)
Network
• One Dedicated BMC LAN located on the rear I/O panel (via AST2600 BMC)
Baseboard Management Controller (BMC)
• ASPEED AST2600 BMC
Graphics
• Graphics controller & VGA support via ASPEED AST2600 BMC
I/O Devices
• • Serial (COM) Port One (serial port on the rear I/O panel (COM1)
Motherboard Features
28
Super X12DDW-A6 User's Manual
Overview of the Processor Heatsink Module
The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and a
3rd Gen Intel Xeon Scalable processor.
1. Heatsink (with Thermal Grease)
2. Processor Carrier
4. Processor Heatsink Module (PHM)
3. The 3rd Gen Intel Xeon Scalable Processor
Bottom View
Bottom View
Produktspecifikationer
| Varumärke: | Supermicro |
| Kategori: | moderkort |
| Modell: | X12DDW-A6 |
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