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0 4 8 12 16 20

Efficiency (%)

Output Current (A)

PVIN = 3.3 V, VIN = 5 V

PVIN = VIN = 5 V

PVIN = VIN = 12 V

C001

Vout = 1.8 V

Fsw = 500 kHz

VOUT

AGND

SENSE+

LMZ31520

FREQ_SEL

SS_SEL

V5V

C

O

C

I

VIN

VIN

VOUT

PGND

VADJ

R

SET

ILIM

INH

PWRGD

PVIN

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Reference

Design

AnIMPORTANTNOTICEattheendofthisdatasheetaddressesavailability,warranty,changes,useinsafety-criticalapplications,

intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LMZ31520

SLVSBM9E–OCTOBER2013–REVISEDSEPTEMBER2018

LMZ3152020-APowerModuleWith3-Vto14.5-VInput

inQFNPackage

1

1Features

1

•CompleteIntegratedPowerSolution;

SmallerthanaDiscreteDesign

•15mm×16mm×5.8mmPackageSize

-PinCompatiblewithLMZ31530

•Ultra-FastLoadStepResponse

•EfficienciesUpTo96%

•Wide-OutputVoltageAdjust

0.6Vto3.6V,with1%ReferenceAccuracy

•OptionalSplitPowerRailsAllows

InputVoltageDownto3V

•SelectableSwitchingFrequency

(300kHzto850kHz)

•SelectableSlow-Start

•AdjustableOvercurrentLimit

•PowerGoodOutput

•OutputVoltageSequencing

•OverTemperatureProtection

•Pre-biasOutputStart-up

•OperatingTemperatureRange:–40°Cto85°C

•EnhancedThermalPerformance:8.6°C/W

•MeetsEN55022ClassAEmissions

-IntegratedShieldedInductor

•CreateaCustomDesignUsingtheLMZ31520

WiththeWEBENCH

®

PowerDesigner

2Applications

•BroadbandandCommunicationsInfrastructure

•DSPandFPGAPointofLoadApplications

•HighDensityPowerSystems

Efficiency

3Description

TheLMZ31520powermoduleisaneasy-to-use

integratedpowersolutionthatcombinesa20-A

DC/DCconverterwithpowerMOSFETs,ashielded

inductor,andpassivesintoalowprofile,QFN

package.Thistotalpowersolutionallowsasfewas

threeexternalcomponentsandeliminatestheloop

compensationandmagneticspartselectionprocess.

The15×16×5.8mmQFNpackageiseasytosolder

ontoaprintedcircuitboardandallowsacompact

point-of-loaddesign.Achievesgreaterthan95%

efficiency,hasultra-fastloadstepresponseand

excellentpowerdissipationcapabilitywithathermal

impedanceof8.6°C/W.TheLMZ31520offersthe

flexibilityandthefeature-setofadiscretepoint-of-

loaddesignandisidealforpoweringawiderangeof

ICsandsystems.Advancedpackagingtechnology

affordsarobustandreliablepowersolution

compatiblewithstandardQFNmountingandtesting

techniques.

SimplifiedApplication

Produktspecifikationer