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Order Number: 334047-001US
Intel® Solid State Drive 540s Series (M.2)
Product Specification
Capacities: , 180, 2 , 360, 480, 1000 GB 120 40
Form Factors:
80mm (single-sided) 2280- -B- S3 M
(120, 180, 2 , 360, 480 ) 40 GB
80mm (double-sided) 2280-D3-B-M (1000 G B)
Thickness: up to 2.38 ; D3 up to 3.73mm S3 –mm –
Weight: <7 grams
SATA 6Gb/s Bandwidth Performance1,2
(IOMeter* Queue Depth 32)
Sequential Read: up to 560MB/s
Sequential Write: up to 480MB/s
Read and Write IOPS1,2
(IOMeter Queue Depth 32)
Random 4KB Reads: up to ,000 IOPS 78
Random 4KB Writes: up to 85,000 IOPS
Additional Compatibility
Intel® SSD Toolbox with Intel® SSD Optimizer
Intel® Data Migration Software
Intel® Rapid Storage Technology
SATA Revision 3.2
ACS-3 (ATA/ATAPI Command Set 3)
SSD Enhanced SMART ATA feature set
AES 256-bit Encryption
Power Management
3.3 V SATA Supply Rail
SATA Link Power Management (LPM)
Device Sleep (DevSleep)
Advanced Power Management (APM)
Power
Active (BAPCo MobileMark* 20 Workload): 12
80 mW
Idle3: 40 mW
DevSleep: 3 mW
Temperature
Operating4: 0° C to 70° C
Non-Operating: - ° C to 95° C 55
Reliability
Uncorrectable Bit Error Rate (UBER):
<1 sector per 1016 bits read
Mean Time Between Failure (MTBF):
1.6 million hours
Shock (non-operating):
1,000 G/0.5 ms
Vibration
Operating: 2.17 GRMS (5-700Hz)
N -operating: 3.13 GRMS (5-800Hz) on
Certifications and Declarations:
UL*
CE*
RCM*
BSMI*
KCC*
Microsoft* WHCK/WHLK
VCCI*
SATA-IO*
Product Ecological Compliance
RoHS*
NOTES:
1. IOMeter Test and System Configurations: -4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® Core™ i7
Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB)
Kingston DDR3-1555,
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
2. Performance values vary by capacity.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper
device operating temperatures on heavier workloads.
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
2 334047- 1US 00
Ordering Information
Contact your local Intel sales representative for ordering information.
Revision History
Revision Number
Description
Revision Date
001
Initial release
March 2016
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will
affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.
For more complete information about performance and benchmark results, visit http://www.intel.com/performance.
IOMeter Test and System Configurations: -4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® HD Intel® Core™ i7
Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DD -1555, R3
Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.
All documented test results are obtained by Intel in compliance with JESD218 Standards; refer to individual sub-sections within this document
for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well
as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular
purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document
contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or go to : http://www.intel.com/design/literature.htm
Intel, Intel Core i7-4790, Intel HD Graphics 4600 Driver, Intel INF, Intel RST and the Intel logo are trademarks of Intel Corporation in the U.S.
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2016 Intel Corporation. All rights reserved.
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
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Contents
1 Introduction .......................................................................................................................................................................................................... 5
1.1 Terminology ............................................................................................................................................................................................... 5
1.2 Reference Documents ........................................................................................................................................................................... 6
2 Product Specifications ..................................................................................................................................................................................... 7
2.1 Capacity ........................................................................................................................................................................................................ 7
2.2 Performance ............................................................................................................................................................................................... 7
2.3 Electrical Characteristics ...................................................................................................................................................................... 8
2.4 Environmental Conditions ................................................................................................................................................................... 9
2.4.1 Temperature, Shock, Vibration ......................................................................................................................................... 9
2.4.2 Altitude ......................................................................................................................................................................................... 9
2 Product Regulatory Compliance .5 ....................................................................................................................................................... 9
2.6 Reliability ................................................................................................................................................................................................... 10
3 Mechanical Information ................................................................................................................................................................................ 11
4 Pin and Signal Descriptions ........................................................................................................................................................................ 13
4.1 Pin Locations ............................................................................................................................................................................................ 13
4.2 Signal Descriptions ............................................................................................................................................................................... 14
5 Supported Command and Feature Sets ............................................................................................................................................... 16
5.1 Supported ATA General Feature Command Set ..................................................................................................................... 16
5.2 Security Features ................................................................................................................................................................................... 18
5.2.1 Sanitization Methods ........................................................................................................................................................ 18
5.3 DevSleep .................................................................................................................................................................................................... 18
5.4 SMART Attributes .................................................................................................................................................................................. 19
6 Certifications and Declarations ................................................................................................................................................................. 22
7 Appendix ............................................................................................................................................................................................................... 23
7.1 Identify Device ......................................................................................................................................................................................... 23
7.2 Models .........................................................................................................................................................................................................26
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
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Tables
Table 1: Terminology ............................................................................................................................................................................................. 5
Table 2: Standard References ............................................................................................................................................................................ 6
Table 3: User Addressable Sectors ................................................................................................................................................................. 7
Table 4: Burst Performance ................................................................................................................................................................................ 7
Table 5: Sustained Performance ...................................................................................................................................................................... 7
Table 6: Latency ....................................................................................................................................................................................................... 8
Table 7: Operating Voltage and Power Consumption ............................................................................................................................ 8
Table 8: Temperature, Shock, Vibration ....................................................................................................................................................... 9
Table 9: Reliability Specifications .................................................................................................................................................................. 10
Table 10: M.2 Serial ATA Power Pin Definitions ........................................................................................................................................ 14
Table 11: Supported ATA Commands and Feature Sets ....................................................................................................................... 16
Table 12: Supported Secure Erase Modes and Definitions .................................................................................................................. 18
Table 13: Supported Sanitize Device Modes and Definitions ............................................................................................................. 18
Table 15: DevSleep Control Parameters ....................................................................................................................................................... 19
Table 16: SMART Attributes ................................................................................................................................................................................ 19
Table 17: SMART Attribute Status Flags ....................................................................................................................................................... 21
Table 18: Device Certifications and Declarations ...................................................................................................................................... 22
Table 19: Identify Device Returned Sector Data ........................................................................................................................................ 23
Table 20: Available Models .................................................................................................................................................................................. 26
Figures
Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280- -B- S3 M) ....................................................... 11
Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280- -B- D3 M) .................................................... 12
Figure 3: Layout of Signal and Power Segment Pins .............................................................................................................................. 13
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
3340 - 1US 5 47 00
1 Introduction
This document describes the specifications and capabilities of the Intel® Solid State Drive 540s Series
(Intel® SSD 540s Series).
1.1 Terminology
Table 1 Terminology :
Term
Description
AHCI*
Advanced Host Controller Interface
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
DPTF
Dynamic Platform Thermal Framework
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
portion of the capacity is used for NAND flash management and maintenance purposes.
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
PIO
Programmed Input/Output
RDT
Reliability Demonstration Test
RMS
Root Mean Squared
SLC
Single-level Cell
SATA
Serial Advanced Technology Attachment
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
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Term
Description
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid State Drive
TYP
Typical
UBER
Uncorrectable Bit Error Rate
1.2 Reference Documents
Table 2: Standard References
Date or Rev. #
Title
Location
Sept 2008
IEC 55022 Information Technology Equipment —
Radio disturbance Characteristics Limits and —
methods of measurement CISPR22:2008 (Modified)
http://www.iec.ch/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet
August 2010
IEC 55024 Information Technology Equipment —
Immunity characteristics Limits and methods of —
measurement CISPR24:2010
http://www.iec.ch/
Sept 2010
Solid State Drive (SSD) Requirements and
Endurance Test Method (JESD218)
http://www.jedec.org/standards-
documents/docs/jesd218/
August 2013
Serial ATA Revision 3.2
http://www.sata-io.org/
October 2013
ACS-3 Specification
http://www.t13.org/
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
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2 Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors
Capacity
Unformatted Capacity (Total User Addressable Sectors in LBA mode)
120GB
234,441,648
180GB
351,651,888
240GB
468,862,128
360GB
703,282,608
480GB
937,703,088
1000GB
1,953,525,168
2.2 Performance
Table 4: Burst Performance
Capacity
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write
1
IOPS
IOPS
MB/s
MB/s
120GB
60,000
50,000
560
400
180GB
71,000
85,000
560
475
240GB
74,000
85,000
560
480
360GB
74,000
85,000
560
480
480GB
78,000
85,000
560
480
1000GB
78,000
85,000
560
480
Note:
1. Performance measured within the SLC cache buffer using IOMeter* with Queue Depth 32.
Table 5: Sustained Performance
Capacity
Specification
Random
4KB Read
(up to)1
Random
4KB Write
(up to)1
Sequential
128KB Read1
Sequential
128KB Write
1
IOPS
IOPS
MB/s
MB/s
120GB
55,000
13,5 00
560
70
180GB
65,000
22,000
560
90
240GB
70,000
29,000
560
100
360GB
70,000
29,000
560
100
480GB
72,000
36,000
560
125
1000GB
72,000
36,000
560
125
Note:
1. Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on 8GB of Logical
Block Address (LBA) range on a full SSD.
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
8 334047- 1US 00
Table 6: Latency
Specification
Intel® SSD 540s Series Type 2280
Read1
50 µs (TYP)
60 µs (TYP)
500 ms (TYP)
< 10 s ec
Write1
Power On To Ready2
Max Power On To Ready3
NOTES:
1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload. Write Cache enabled.
2. Power On To Ready time assumes safe shutdown
3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of
service.
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
Electrical Characteristi cs
Intel SSD 540s Series Type 2280 ®
120GB
180GB
240GB
360GB
480GB
1000GB
Operating Voltage for 3.3 V (±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time1
3.14 V
3.47 V
100 ms / 0.1 ms
5 s / 1 ms
70 mV pp (10 Hz 30 MHz) –
1 s
Power Consumption (TYP)
Active2
Idle3
DevSleep4
80 mW
40 mW
3 mW
Thermal Power5
Regulator Power6
NOTES:
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.
2. Active power measured during execution of MobileMark* 20 with SATA Link Power Management (LPM) enabled. 12
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This
represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This
represents power that system power supply would have to regulate for proper device operation.
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
3340 - 1US 9 47 00
2.4 Environmental Conditions
2.4.1 Temperature, Shock, Vibration
Table 8: Temperature, Shock, Vibration
Electrical Characteristics
Range
Module Temperature
Operating1
Non-operating2
0° ° C C –70
- ° ° C 55 C –95
Temperature Gradient3
Operating
Non-operating
30 (TYP)° C/hr
30 (TYP)° C/hr
Humidity
Operating
Non-operating
5 – 95 %
5 – 95 %
Shock and Vibration
Range
Shock4
Non-operating
1, 00 0 G (Max) at 0.5 msec
Vibration5
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
3.13 GRMS (5-800 Hz) Max
NOTES:
1. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for
maintaining proper device operating temperature on heavier workloads.
2. Please contact your Intel representative for details on the non-operating temperature range.
3. Temperature gradient measured without condensation.
1. Shock specifications assume SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using peak acceleration and
pulse width value.
2. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting
screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using G Root Mean
Squared (GRMS) value.
2.4.2 Altitude
The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive tested under
non-operational conditions to pressures representative of -1 K and +40 K feet.
2.5 Product Regulatory Compliance
The Intel SSD 540s Series meets or exceeds the regulatory or certification requirements as specified in the Intel
SSD 540s Series Declaration of Conformity at http://www.intel.com/content/www/us/en/library/tech-
docs.results.html?mTag=rresourcetype:technicaldocument/declarationofconformity
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
10 00 334047- 1US
2.6 Reliability
The Intel SSD 540s Series meets or exceeds SSD endurance and data retention requirements as specified in the
JESD218 specification.
Table 9: Reliability Specifications
†120GB qualified to 20 GB of host writes per day. SSD
Parameter
Val ue
Uncorrectable Bit Error Rate (UBER)
Uncorrectable bit error rate will not exceed one sector in the specified number of bits
read. In the unlikely event of a non-recoverable read error, the SSD will report it as a
read failure to the host; the sector in error is considered corrupt and is not returned to
the host.
< 1 sector per 1016 bits read
Mean Time Between Failures (MTBF)
Mean Time Between Failures is estimated based on Telcordia* methodology and
demonstrated through Reliability Demonstration Test (RDT).
≥ 1.6 million hours
Minimum Useful Life/Endurance Rating
The SSD will have a minimum of five years of useful life under typical client workloads
with up to 40 GB† of host writes per day.
5 years
Insertion Cycles
Maximum insertion/removal cycles on M.2 port
250 insertion/removal cycles
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
3340 - 1US 47 00 11
3 Mechanical Information
The following figures show the mechanical information for the single-sided, 80 mm height, M.2 Intel SSD
540s Series. All dimensions are in millimeters.
Figure 1: Dimensions for 80 mm single-sided M.2 Form Factor Drives (2280- -B- S3 M)
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
12 00 334047- 1US
Figure 2: Dimensions for 80 mm double-sided M.2 Form Factor Drives (2280- -B- D3 M)
Intel® Solid State Drive 540s Series (M.2)
March 2016 Product Specification
3340 - 1US 47 00 13
4 Pin and Signal Descriptions
4.1 Pin Locations
Figure 3: Layout of Signal and Power Segment Pins
Intel® Solid State Drive 540s Series (M.2)
Product Specification March 2016
14 00 334047- 1US
4.2 Signal Descriptions
Table : M.2 Serial ATA Power Pin Definitions 10
Pin
Function
Definition
P1
CONFIG_3
Ground
P2
+3.3 V
3.3 V Source
P3
G ND
Ground
P4
+3.3 V
3.3 V Source
P5
Reserved
No Connect
P6
Reserved
No Connect
P7
Reserved
No Connect
P8
Reserved
No Connect
P9
Reserved
No Connect
P10
DAS/DSS#
Device Activity Signal / Disable Staggered Spin- up
P11
Reserved
No Connect
P12
Notch
No Connect
P13
Notch
No Connect
P14
Notch
No Connect
P15
Notch
No Connect
P16
Notch
No Connect
P17
Notch
No Connect
P18
Notch
No Connect
P19
Notch
No Connect
P20
Reserved
No Connect
P21
CONFIG_0
Ground
P22
Reserved
No Connect
P23
Reserved
No Connect
P24
Reserved
No Connect
P25
Reserved
No Connect
P26
Reserved
No Connect
P27
GND
Ground
P28
Reserved
No Connect
P29
Reserved
No Connect
P30
Reserved
No Connect
P31
Reserved
No Connect
P32
Reserved
No Connect
P33
GND
Ground
P34
Reserved
No Connect
P35
Reserved
No Connect
P36
Reserved
No Connect
P37
Reserved
No Connect
P38
DEVSLP
DevSleep Pin
P39
GND
Ground
P40
Reserved
No Connect
P41
+B
Host Receiver Differential Signal Pair (This is an output of the SSD)
P42
Reserved
No Connect
P43
-B
Host Receiver Differential Signal Pair (This is an output of the SSD)
Produktspecifikationer
| Varumärke: | Intel |
| Kategori: | Solid State-enheter (ssd) |
| Modell: | 540s |
| Färg på produkten: | Zwart |
| Förpackningens vikt: | 4920 g |
| Strömförsörjning: | AC 100/240 VAC |
| Skärm diagonal: | 17 " |
| Upplösning: | 1280 x 1024 Pixels |
| Pekskärm: | Nee |
| Betraktningsvinkel, horisontell: | 160 ° |
| Betraktningsvinkel, vertikal: | 160 ° |
| Typiskt kontrastförhållande: | 800:1 |
| VGA (D-Sub) port(ar): | 1 |
| Mikrofon, linjeingång: | Ja |
| Genomsnittlig effekt: | 2 W |
| Strömförbrukning (i standby): | 2 W |
| Certifiering: | FCC-B, UL/cUL, CE, WEEE, Rohs |
| HDCP: | Nee |
| Respons tid: | 5 ms |
| Pixelpitch: | 0.264 x 0.264 mm |
| Panelmonteringsgränssnitt: | 75 x 75 mm |
| DVI-D-portar: | 1 |
| Hållbarhetscertifikat: | ENERGY STAR |
| Ljusstyrka (typiskt): | 300 cd/m² |
| Integrerad TV-tuner: | Nee |
| Inbyggd kamera: | Nee |
| Djup (utan bas): | 40 mm |
| Höjd (utan bas): | 325 mm |
| Bredd (utan bas): | 385 mm |
| Vikt (utan bas): | 3920 g |
| Enhetsbredd (med stativ): | 385 mm |
| Djupenhet (med stativ): | 185 mm |
| Enhetshöjd (med stativ): | 400 mm |
| Bildstorlek (horisontell): | 338 mm |
| Bildstorlek (vertikal): | 270 mm |
| Strömförbrukning (typiskt): | 40 W |
| Tiltvinkelområde: | -5 - 40 ° |
| Skärmuppdateringsfrekvens: | 60 - 75 Hz |
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